Inertial Sensor

• US 20160291050A1
• Filed: 10/28/2014
• Published: 10/06/2016
• Est. Priority Date: 11/12/2013
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ehrenpfordt, Ricardo, Pantel, Daniel, Ante, Frederik
• Application Number:
  US15/035,459
• Publication Number:
  US 20160291050A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 1/003 used for damping
• CPC Class Codes: G01P 2015/0882 for providing damping of vibrations

Abstract

An inertial sensor includes a first sensor element, which is damped against vibrations from an interface of the inertial sensor by a damping element. The first sensor element is configured to detect a first measured variable in a first frequency band, and the damping element is configured to dampen vibrations at least in the first frequency band. The inertial sensor further includes a second sensor element, which is mechanically coupled to the interface. The second sensor element is configured to detect a second measured variable in a second frequency band.

Claims

1. An inertial sensor comprising:

an interface;

a first sensor element, which is vibrationally damped in relation to the interface by a damping element, the first sensor element being configured to detect a first measurement quantity in a first frequency band and the damping element being configured to damp vibrations in at least the first frequency band; and

a second sensor element, which is mechanically coupled to the interface, the second sensor element being configured to detect a second measurement quantity in a second frequency band.

2. The inertial sensor as claimed in claim 1, wherein the second sensor element is coupled without damping to the interface.

3. The inertial sensor as claimed in claim 1, wherein:

the damping element is a flexible beam structure which connects a part, coupled to the interface, of the inertial sensor to a vibratable part of the inertial sensor, and

the first sensor element is connected to the vibratable part.

4. The inertial sensor as claimed in claim 3, wherein:

the beam structure bridges a gap which is arranged between an annularly circumferential ring, coupled to the interface, of the inertial sensor and a vibratable island, and

a beam of the beam structure connects a side surface of the island to an inner surface of the ring, the inner surface oriented transversely to the side surface.

5. The inertial sensor as claimed in, claim 1, further comprising:

a first substrate layer and a second substrate layer, the substrate layers being arranged in different planes,

wherein the first sensor element is arranged on the first substrate layer and the second sensor element is arranged on the second substrate layer.

6. The inertial sensor as claimed in claim 5, further comprising:

at least one central substrate layer arranged between the first substrate layer and the second substrate layer, the at least one central substrate layer separating the first substrate layer from the second substrate layer and forming a cavity between the first substrate layer and the second substrate layer.

7. The inertial sensor as claimed in claim 5, wherein:

the substrate layers are connected to one another by solder balls, and

the solder balls form at least one of an electrical contact and a mechanical contact.

8. The inertial sensor as claimed in claim 6, further comprising:

a sealing device configured to seal the cavity, the sealing device arranged between the substrate layers.

9. The inertial sensor as claimed in claim 6, wherein at least one of the substrate layers has an annularly circumferential foot configured to define a distance between the substrate layers and form the cavity.

10. The inertial sensor as claimed in claim 1, wherein the first sensor element and the second sensor element are arranged on a substrate.

11. The inertial sensor as claimed in, claim 1, wherein at least one of the first sensor element and the second sensor element has an integrated circuit configured to process sensor signals of at least one of the first sensor element and the second sensor element.

12. The inertial sensor as claimed in, claim 1, wherein one of the first sensor element and the second sensor element is a rotation rate sensor and the other of the first sensor element and the second sensor element is an acceleration sensor.