THIN FILM CAPACITOR

• US 20160293334A1
• Filed: 03/29/2016
• Published: 10/06/2016
• Est. Priority Date: 03/31/2015
• Status: Abandoned Application

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: EHARA, Shinji, ONODERA, Ikuhito, WAKATA, Eiko, OSANAI, Katsunori, TANIGUCHI, Masamichi
• Application Number:
  US15/083,649
• Publication Number:
  US 20160293334A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01G 4/008 Selection of materials
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/018 Dielectrics
• CPC Class Codes: H01G 4/224 Housing; Encapsulation
• CPC Class Codes: H01G 4/306 made by thin film techniques
• CPC Class Codes: H01G 4/33 Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
• CPC Class Codes: H01L 28/92 made by patterning layers, e.g. by etching conductive layers

Abstract

A lower electrode (4) can have an uneven surface structure. An upper electrode (6) can also have the uneven surface structure. A projecting portion of the upper electrode (6) projecting to the lower electrode side is positioned in a gap between projecting portions of the lower electrode (4) and the lower electrode (4) includes Cu as a main component. Young'"'"'s moduli of a substrate (1), a stress adjustment layer (2), and the lower electrode (4) have a specific relation. Also, corner portions of radii (R1) of curvature positioned inside a projecting portion (4b) have a specific relation.

Claims

1. A thin film capacitor comprising:

a substrate;

a stress adjustment layer formed on a main surface of the substrate;

a lower electrode formed on the stress adjustment layer;

a dielectric thin film configured to cover the lower electrode; and

an upper electrode formed on the dielectric thin film,

wherein the lower electrode has an uneven surface structure of a vertical cross section in a thickness direction of the substrate,

wherein the upper electrode has an uneven surface structure of a vertical cross section in a thickness direction of the substrate,

wherein a projecting portion of the upper electrode projecting to a lower electrode side is positioned in a gap between projecting portions of the lower electrode,

wherein the lower electrode includes Cu as a main component, and

wherein a Young'"'"'s modulus E_SS of the substrate, a Young'"'"'s modulus E_SC of the stress adjustment layer, and a Young'"'"'s modulus E_LE of the lower electrode satisfy the relational expressions E_LE<

E_SC and E_SS<

E_SC.

2. The thin film capacitor according to claim 1, wherein a linear expansion coefficient α

_SS of the substrate, a linear expansion coefficient α

_SC of the stress adjustment layer, and a linear expansion coefficient α

_LE of the lower electrode satisfy the relational expressions α

_SC<

α

_LE and α

_SC<

α

_SS.

3. The thin film capacitor according to claim 1, wherein a heat conductivity λ

_SS of the substrate, a heat conductivity λ

_SC of the stress adjustment layer, and a heat conductivity λ

_LE of the lower electrode satisfy the relational expressions λ

_SC<

λ

_SS and λ

_SC<

λ

_LE.

4. The thin film capacitor according to claim 1,

wherein the lower electrode includes

a common electrode part extending in parallel to a main surface of the substrate;

and

a plurality of projecting portions extending to project away from the substrate from the common electrode part,

wherein the thin film capacitor includes;

a protective film configured to cover the upper electrode;

a dummy electrode formed on the stress adjustment layer; and

a lower contact electrode formed on the common electrode part of the lower electrode,

wherein the dielectric thin film, the upper electrode, and a first connection electrode are positioned on the dummy electrode,

wherein the lower contact electrode in contact with the common electrode part and a second connection electrode are positioned on the common electrode part of the lower electrode via an opening provided in the dielectric thin film,

wherein the dummy electrode has the same thickness as the common electrode part of the lower electrode,

wherein the first connection electrode is positioned within a first contact hole provided in the protective film, and

wherein the second connection electrode is positioned within a second contact hole provided in the protective film.

5. A thin film capacitor comprising:

a substrate;

an insulating layer formed on a main surface of the substrate;

a lower electrode formed on the insulating layer;

a dielectric thin film configured to cover the lower electrode; and

an upper electrode formed on the dielectric thin film,

wherein the lower electrode has an uneven surface structure of a vertical cross section in a thickness direction of the substrate,

wherein the upper electrode has an uneven surface structure of a vertical cross section in a thickness direction of the substrate,

wherein a projecting portion of the upper electrode projecting to a lower electrode side is positioned in a gap between projecting portions of the lower electrode,

wherein, when an XYZ three-dimensional coordinate system is set, the main surface is an XY plane, and a direction in which a plurality of projecting portions of the lower electrode are arranged is designated as an X-axis direction, a distal end of the projecting portion of the lower electrode within the XZ plane has a corner portion of a radius R1 of curvature in which a center of curvature is positioned inside the projecting portion, and

wherein the radius R1 of curvature and a thickness td of the dielectric thin film satisfy the relational expression 0.4×

td≦

R1≦

20×

td.

6. The thin film capacitor according to claim 5,

wherein a proximal end of the projecting portion of the lower electrode within the XZ plane has a corner portion of a radius R2 of curvature in which a center of curvature is positioned outside the projecting portion, and

wherein the radius R2 of curvature and the thickness td of the dielectric thin film satisfy the relational expression 0.4×

td≦

R2≦

20×

td.

7. The thin film capacitor according to claim 5,

wherein the distal end of the projecting portion of the lower electrode within the YZ plane has a corner portion of a radius R3 of curvature in which a center of curvature is positioned inside the projecting portion, and

wherein the radius R3 of curvature and the thickness td of the dielectric thin film satisfy the relational expression 0.4×

td≦

R3≦

20×

td.

8. The thin film capacitor according to claim 5,

wherein the distal end of the projecting portion of the lower electrode within the YZ plane has a corner portion of a radius R4 of curvature in which a center of curvature is positioned outside the projecting portion, and

wherein the radius R4 of curvature and the thickness td of the dielectric thin film satisfy the relational expression 0.4×

td≦

R4≦

20×

td.

9. The thin film capacitor according to claim 5, wherein the relational expression 0.5×

td≦

R1≦

10×

td is satisfied.

10. The thin film capacitor according to claim 5, wherein the relational expression 0.5×

td≦

R2≦

10×

td is satisfied.

11. The thin film capacitor according to claim 5,

wherein the insulating layer is a stress adjustment layer, and

wherein a Young'"'"'s modulus of the stress adjustment layer is greater than a Young'"'"'s modulus of the substrate and greater than a Young'"'"'s modulus of the lower electrode.

12. A thin film capacitor comprising:

a substrate;

an insulating layer formed on a main surface of the substrate;

a lower electrode formed on the insulating layer;

a dielectric thin film configured to cover the lower electrode;

an upper electrode formed on the dielectric thin film;

a first terminal provided in the lower electrode; and

a second terminal provided in the upper electrode,

wherein, when an XYZ three-dimensional coordinate system is set, the main surface is an XY plane, and a direction in which the first terminal and the second terminal are connected is designated as an X-axis, the lower electrode has an uneven surface structure and a longitudinal direction of a top surface of the projecting portion of the uneven surface structure is in the X-axis direction.

13. The thin film capacitor according to claim 12, wherein the width of the projecting portion of the lower electrode in a Y-axis direction narrows from a proximal end to a distal end.

14. The thin film capacitor according to claim 13, wherein, when a ratio between a Y-axis direction width W1 of the proximal end of the projecting portion of the lower electrode and a Y-axis direction width W2 of the distal end of the projecting portion of the lower electrode is RW=W1/W2, the ratio RW satisfies the relational expression 1.2≦

RW≦

1.9.