×

Three Dimensional Lead-Frames For Reduced Crosstalk

  • US 20160294121A1
  • Filed: 03/21/2016
  • Published: 10/06/2016
  • Est. Priority Date: 04/02/2015
  • Status: Active Grant
First Claim
Patent Images

1. A receptacle, comprising:

  • a conductive plate having a first surface and a second surface;

    a first lead-frame having a plurality of leads, each lead of the first lead-frame comprising a contact at one end, a body, a corner, and a pin at the other end, the body being between the contact and the corner;

    a first insulator interposed between the first surface of the conductive plate and at least a portion of each lead of the plurality of leads of the first lead-frame;

    a second lead-frame having a plurality of leads, each lead of the second lead-frame comprising a contact at one end, a body, a corner, and a pin at the other end, the body being between the contact portion and the corner portion;

    a second insulator interposed between the second surface of the conductive plate and at least a portion of each lead of the plurality of leads of the second lead-frame;

    one lead of at least one of the first lead-frame or the second lead-frame further comprising a tab, the tab being at least one of;

    conductively coupled to the conductive plate, or capacitively coupled to the conductive plate; and

    an overmold covering at least a portion of the first lead-frame, the second lead-frame, the first insulator, the second insulator, and the conductive plate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×