Co-Fired Passive Integrated Circuit Devices
First Claim
1. A method of circuit device fabrication, the method comprising:
- receiving a first substrate;
applying a conductive material to the first substrate such that a loop of the conductive material is formed on the first substrate;
applying a magnetic material to the first substrate and surrounding at least a portion of the loop;
performing a thermal process on the first substrate having the conductive material and the magnetic material applied thereupon;
bonding the conductive material to a second substrate; and
thereafter, separating the conductive material and the magnetic material from the first substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A variety of integrated circuit devices and a method for their formation and integration are provided. The integrated circuit devices may include inductors, capacitors, and/or other passive devices. In an exemplary embodiment, a first substrate is received and a conductive material is applied to the first substrate such that a loop of the conductive material is formed on the first substrate. A magnetic material is applied to the first substrate and surrounds at least a portion of the loop. A thermal process is performed on the first substrate having the conductive material and the magnetic material applied thereupon. The conductive material is bonded to a second substrate, and thereafter, the conductive material and the magnetic material are separated from the first substrate.
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Citations
20 Claims
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1. A method of circuit device fabrication, the method comprising:
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receiving a first substrate; applying a conductive material to the first substrate such that a loop of the conductive material is formed on the first substrate; applying a magnetic material to the first substrate and surrounding at least a portion of the loop; performing a thermal process on the first substrate having the conductive material and the magnetic material applied thereupon; bonding the conductive material to a second substrate; and thereafter, separating the conductive material and the magnetic material from the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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receiving a carrier substrate; forming at least one passive device structure on the carrier substrate; firing the carrier substrate after the forming of the at least one passive device structure; bonding the carrier substrate to a circuit substrate, wherein the bonding includes electrically coupling the at least one passive device structure to a circuit element of the circuit substrate; and separating the carrier substrate from the at least one passive device structure after the bonding. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A circuit device comprising:
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a circuit element disposed on a substrate; a bonding structure disposed on the substrate and electrically coupled to the circuit element; and a co-fired ceramic passive device physically and electrically coupled to the bonding structure. - View Dependent Claims (19, 20)
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Specification