IMAGING MODULE AND CATHETER

• US 20160296102A1
• Filed: 03/02/2016
• Published: 10/13/2016
• Est. Priority Date: 04/09/2015
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: SHIMONO, Takahiro, SHIRATANI, Hideo, ISHIBASHI, Kenichi
• Granted Patent: US 10,660,507 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 1/00096 Optical elements
• CPC Class Codes: A61B 1/00114 Electrical cables in or with an endoscope
• CPC Class Codes: A61B 1/00124 electrical, e.g. electrical plug-and-socket connection
• CPC Class Codes: A61B 1/04 combined with photographic or television appliances
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61M 25/00 Catheters; Hollow probes dilators A61M29/00; peritoneal catheters A61M1/285; tracheal tubes A61M16/04; for drainage A61M27/00; for uterus, vagina or rectum A61M31/00 ; for measuring or testing A61B; materials for catheters A61L29/00

Abstract

An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.

Claims

1. An imaging module comprising:

an electrical cable;

a solid-state imaging element comprising an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and

a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together,

wherein the flexible wiring substrate comprises an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion, and

wherein an internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which a glass-transition temperature is 135°

C. or less.

2. The imaging module according to claim 1,

wherein the rear pieces comprise extending portions configured so that portions, which comprise at least extending ends, approach each other as the extending portions are away from the element mounting portion, and connecting pieces further extending from the extending ends, and

wherein the internal space is surrounded by the element mounting portion and the extending portions.

3. The imaging module according to claim 1,

wherein the outside dimensions of the flexible wiring substrate comprising the element mounting portion and the two rear pieces, which cover the adhesive resin, are equal to or less than the outside dimensions of the solid-state imaging element.

4. The imaging module according to claim 1,

wherein the adhesive resin is an acrylic resin or an epoxy-based resin.

5. The imaging module according to claim 2,

wherein the adhesive resin has intermediate corners between first, second corners, which are formed between the element mounting portion and the two extending portions, and a third corner formed in a place where the two extending portions meet, respectively, and is formed in a polygonal shape having five or ore sides as a whole.

6. The imaging module according to claim 1,

wherein a rate of volumetric shrinkage in curing of the adhesive resin is 3% or more.

7. A catheter comprising:

an imaging module according to claim 1.