DIELECTRIC THICK FILM INK

• US 20160297977A1
• Filed: 04/07/2015
• Published: 10/13/2016
• Est. Priority Date: 04/07/2015
• Status: Active Grant

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations LLC (General Motors Company)
• Inventors: Albaugh, Lisa M., Smith, David A., Guse, Timothy J.
• Granted Patent: US 10,113,073 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: C09D 11/03 characterised by features other than the chemical nature of the binder
• CPC Class Codes: C09D 11/037 characterised by the pigment
• CPC Class Codes: C09D 11/14 based on carbohydrates
• CPC Class Codes: C09D 11/52 Electrically conductive inks
• CPC Class Codes: C09K 5/10 Liquid materials
• CPC Class Codes: H01B 3/08 quartz; glass; glass wool; slag wool; vitreous enamels
• CPC Class Codes: H01B 3/12 ceramics

Abstract

A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Claims

1. A thermally conductive thick film dielectric ink for an electronic device, the thick film dielectric ink comprising a mixture of:

an organic medium;

a glass binder; and

a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

2. The thermally conductive thick film dielectric ink of claim 1, wherein the technical ceramic powder is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink.

3. The thermally conductive thick film dielectric ink of claim 2, wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride.

4. The thermally conductive thick film dielectric ink of claim 1, wherein the organic medium is present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink.

5. The thermally conductive thick film dielectric ink of claim 4, wherein the organic medium comprises 2,2,4-trimethyl-1,3-pentanediol, Diethylene Glycol Dibutyl Ether, Dodecyl Alcohol, Tridecyl Alcohol, and Ethyl Cellulose.

6. The thermally conductive thick film dielectric ink of claim 5, wherein the 2,2,4-trimethyl-1,3-pentanediol is present in an amount from about 81.0% to about 82.0% by weight of the organic medium, the Diethylene Glycol Dibutyl Ether is present in an amount from about 7.0% to about 11.0% by weight of the organic medium, the Dodecyl Alcohol is present in an amount about 2.0% by weight of the organic medium, the, Tridecyl Alcohol is present in an amount from about 1.0% to about 4.0% by weight of the organic medium, and the Ethyl Cellulose is present in an amount from about 3.0 to about 6.5% by weight of the organic medium.

7. The thermally conductive thick film dielectric ink of claim 1, wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink.

8. The thermally conductive thick film dielectric ink of claim 7, wherein the glass binder comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

9. The thermally conductive thick film dielectric ink of claim 8, wherein the lead(II) oxide is present in an amount from about 65.0% to about 67.5% by weight of the glass binder, the silicon dioxide is present in an amount from about 21.5% to about 22.5% by weight of the glass binder, the boron trioxide is present in an amount from about 8.0% to about 9.0% by weight of the glass binder, and the aluminum oxide is present in an amount from about 2.0% to about 3.0% by weight of the glass binder.

10. A power inverter for hybrid vehicles comprising:

a metal layer forming a circuit on which electronic components are disposed;

a substrate forming a heat sink; and

a thick film dielectric ink layer according to claim 1, wherein the thick film thermally conductive dielectric ink layer is interposed between the metal layer and the substrate.

11. An electronic device comprising:

a metal layer forming a circuit on which electronic components are disposed;

a substrate forming a heat sink; and

a thick film dielectric ink layer interposed between the metal layer and the substrate, wherein the thick film dielectric ink layer is thermally conductive.

12. The electronic device of claim 11, wherein the thick film thermally conductive dielectric ink comprises an organic medium, a glass binder, and a technical ceramic power.

13. The electronic device of claim 12, wherein the technical ceramic powder is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink.

14. The electronic device of claim 13, wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride.

15. The electronic device of claim 11, wherein the organic medium is present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink and comprises 2,2,4-trimethyl-1,3-pentanediol, Diethylene Glycol Dibutyl Ether, Dodecyl Alcohol, Tridecyl Alcohol, and Ethyl Cellulose.

16. The electronic device of claim 11, wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink and comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

17. The electronic device of claim 11, wherein the substrate is a conductive metallic substrate containing aluminum, copper, or stainless steel, or alternatively, the substrate is a ceramic substrate containing alumina, silicon nitride, silicon carbide, or aluminum nitride.

18. The electronic device of claim 11, wherein the electronic device is an electronic power module.

19. A method of making an electronic device, the method comprising the steps of:

depositing a thick film thermally conductive dielectric ink overlying a substrate, wherein the thick film thermally conductive dielectric ink comprises a mixture of;

an organic medium;

a glass binder; and

a technical ceramic powder;

firing the thick film thermally conductive dielectric ink to form a bond to the substrate; and

depositing a thick film conductive ink trace onto the thick film thermally conductive dielectric ink.

20. The method of making an electronic device according to claim 19, wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride, and is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink, and wherein the organic medium is present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink and comprises 2,2,4-trimethyl-1,3-pentanediol, Diethylene Glycol Dibutyl Ether, Dodecyl Alcohol, Tridecyl Alcohol, and Ethyl Cellulose, and wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink and comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.