PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

• US 20160302308A1
• Filed: 09/30/2015
• Published: 10/13/2016
• Est. Priority Date: 04/07/2015
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Jeong Ho, KWEON, Young Do, KIM, Hyoung Joon, KOOK, Seung Yeop
• Application Number:
  US14/871,065
• Publication Number:
  US 20160302308A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 2201/048 Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4694 Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density H05K3/4691 takes precedence

Abstract

There are provided a printed circuit board, an electronic component module and a method of manufacturing the same. The printed circuit board includes a circuit board including a through hole and a first circuit pattern, and a connection board having a microcircuit structure including a second circuit pattern, the connection board accommodated in the through hole.

Claims

1. A printed circuit board comprising:

a circuit board comprising a through hole and a first circuit pattern; and

a connection board having a microcircuit structure comprising a second circuit pattern, the connection board accommodated in the through hole.

2. The printed circuit board of claim 1, wherein the circuit board is a multilayer board comprising a plurality of circuit layers and insulating layers, and

at least one of the insulating layers is interposed between the plurality of circuit layers.

3. The printed circuit board of claim 1, wherein the first circuit pattern comprises first pads for mounting electronic components.

4. The printed circuit board of claim 1, wherein the microcircuit structure is disposed on one surface or both surfaces of the connection board.

5. The printed circuit board of claim 1, wherein the microcircuit structure comprises microcircuit layers disposed on both surfaces of the connection board and electrically connected to each other by a via.

6. The printed circuit board of claim 1, wherein the microcircuit structure comprises a plurality of circuit layers and insulating layers, and

at least one of the insulating layers is interposed between the plurality of circuit layers.

7. The printed circuit board of claim 6, wherein the insulating layer is a photosensitive insulating layer.

8. The printed circuit board of claim 1, wherein the second circuit pattern comprises a signal line for connecting electronic components to each other.

9. The printed circuit board of claim 1, wherein the second circuit pattern comprises second pads for mounting electronic components.

10. The printed circuit board of claim 1, wherein the second circuit pattern comprises a micropattern having a pitch smaller than that of the first circuit pattern.

11. The printed circuit board of claim 1, further comprising a build-up layer including an insulating build-up layer and a circuit build-up layer disposed on the circuit board and the connection board.

12. The printed circuit board of claim 1, further comprising a solder resist layer disposed on the circuit board.

13. The printed circuit board of claim 1, further comprising a resin filler disposed between the connection board and the through hole.

14. The printed circuit board of claim 13, wherein the resin filler is a solder resist.

15. An electronic component module comprising:

a printed circuit board comprising a circuit board having a through hole and a first circuit pattern, and a connection board having a microcircuit structure comprising a second circuit pattern, the connection board accommodated in the through hole; and

electronic components mounted on one surface or both surfaces of the printed circuit board.

16. The electronic component module of claim 15, wherein the second circuit pattern comprises a micropattern having a pitch smaller than that of the first circuit pattern.

17. A method of manufacturing a printed circuit board, the method comprising:

preparing a circuit board having a through hole and comprising a first circuit pattern; and

inserting a connection board in the through hole,

wherein the connection board comprises a microcircuit structure comprising a second circuit pattern.

18. The method of claim 17, further comprising preparing the connection board prior to the inserting of the connection board in the through hole such that the circuit board is a multilayer board comprising circuit layers and insulating layers disposed on a first side of a core insulating layer and on a second side of the core insulating layer opposite the first side, a via electrically connecting the first side to the second side of the connection board.

19. The method of claim 18, further comprising mounting one or more electronic components on one surface or both surfaces of the printed circuit board.