PROXIMITY LUMINANCE SENSOR AND METHOD FOR MANUFACTURING SAME

• US 20160305817A1
• Filed: 03/05/2014
• Published: 10/20/2016
• Est. Priority Date: 05/08/2013
• Status: Abandoned Application

• Current Assignee: ITM Semiconductor Co., Ltd.
• Original Assignee: ITM Semiconductor Co., Ltd.
• Inventors: KIM, Yung Jun, GU, Ja Guen, LEE, Su Seok
• Application Number:
  US14/781,086
• Publication Number:
  US 20160305817A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01J 1/08 Arrangements of light sources specially adapted for photometry standard sources, also using luminescent or radioactive material
• CPC Class Codes: G01J 1/44 Electric circuits for command of an exposure part G03B7/02
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 31/02002 Arrangements for conducting electric current to or from the device in operations
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/16 the semiconductor device sensitive to radiation being controlled by the light source or sources
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present invention relates to a proximity luminance sensor obtained by assembling a housing array to a printed circuit board array using an adhesive layer, prior to separation into individual proximity luminance sensors, thereby preventing contamination or damage to lenses, decreasing the optical interference phenomenon, reducing the manufacturing cost and manufacturing time, and thus substantially improving productivity. The proximity luminance sensor may comprise: a printed circuit board; a light-emitting chip mounted on the printed circuit board; a light-receiving chip mounted on the printed circuit board; a light-emitting lens unit surrounding the light-emitting chip; a light-receiving lens unit surrounding the light-receiving chip; a housing shaped to surround the light-emitting chip and the light-receiving chip and provided with a light-emitting window, which corresponds to the light-emitting lens unit, and a light-receiving window, which corresponds to the light-receiving lens unit; and an adhesive layer installed between the housing and the printed circuit board.

Claims

1. A method of manufacturing a proximity luminance sensor, the method comprising:

mounting a plurality of light-emitting chips and a plurality of light-receiving chips on a printed circuit board array, and connecting a signal transmitting member to each of the chips;

molding a light-emitting lens unit surrounding the light-emitting chips and a light-receiving lens unit surrounding the light-receiving lens unit on the printed circuit board array;

assembling a housing array having a light-emitting window corresponding to the light-emitting lens unit and a light-receiving window corresponding to the light-receiving lens unit to the printed circuit board array where the light-emitting lens unit and the light-receiving lens unit are molded; and

separating individual proximity luminance sensors from the printed circuit board array assembled with the housing array.

2. The method of claim 1, wherein, in the molding of the lens unit, the light-emitting lens unit comprises a plurality of light-emitting lens body unit and a light-emitting lens gate and runner unit connecting the light-emitting lens body units,

wherein the light-receiving lens unit comprises a plurality of light-receiving body unit and a light-receiving lens gate and runner unit connecting the light-receiving lens body units.

3. The method of claim 1, wherein, the assembling of the housing array comprises assembling the printed circuit board array and the housing array using an adhesive layer disposed between the printed circuit board array and the housing array.

4. The method of claim 1, wherein the separating of the individual proximity luminance sensors comprises cutting the housing array along a cutting line using a sawing process.

5. A proximity luminance sensor, comprising:

a printed circuit board;

a light-emitting chip mounted on the printed circuit board;

a light-receiving chip mounted on the printed circuit board;

a light-emitting lens unit surrounding the light-emitting chip;

a light-receiving lens unit surrounding the light-receiving chip;

a housing shaped to surround the light-emitting chip and the light-receiving chip and provided with a light-emitting window, which corresponds to the light-emitting lens unit, and a light-receiving window, which corresponds to the light-receiving lens unit; and

an adhesive layer installed between the housing and the printed circuit board.

6. The proximity luminance sensor of claim 5, wherein the housing comprises a blocking wall blocking between the light-emitting chip and the light-receiving chip.

7. The proximity luminance sensor of claim 5, wherein the housing comprises a synthetic resin,

wherein cutting surfaces are formed on sides of the housing,

wherein a portion of light-emitting lens gate and runner unit formed during the molding of the light-emitting lens unit is exposed on the cutting surface,

wherein a portion of light-receiving lens gate and runner unit G2 formed during molding the light-receiving lens unit is exposed on the cutting surface.

8. The proximity luminance sensor of claim 5, wherein the adhesive layer is made of an opaque material including an epoxy composite so as to prevent a crosstalk phenomenon in which a light generated from the light-emitting chip is directly transmitted to the light-receiving chip.