THERMAL MANAGEMENT OF THERMAL SENSOR IN A MOBILE DEVICE

• US 20160305829A1
• Filed: 09/25/2015
• Published: 10/20/2016
• Est. Priority Date: 04/14/2015
• Status: Active Grant

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Emadi, Arvin, Bhat, Jerome C.
• Granted Patent: US 10,371,578 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01J 5/0816 using attenuators
• CPC Class Codes: G01J 5/0881 Compact construction
• CPC Class Codes: G01J 5/12 using thermoelectric elements, e.g. thermocouples
• CPC Class Codes: G01J 5/16 Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables

Abstract

A mobile thermal sensor system, a mobile device case, and a process for fabricating a mobile thermal sensor system are described that include using a heat spreader (e.g., a heat sink). In an implementation, the mobile thermal sensor system includes a substrate configured to support an electrical component; a thermal detector package coupled to the substrate, the thermal detector package including a first thermopile, a second thermopile, and a reference temperature detector; and a heat spreader coupled to the substrate. In another implementation, a mobile device case can include a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system.

Claims

1. A mobile thermal sensor system, comprising:

a substrate configured to support an electrical component;

a thermal detector package coupled to the substrate, the thermal detector package including

a first thermopile,

a second thermopile, and

a reference temperature detector; and

a heat spreader coupled to the substrate.

2. The mobile thermal sensor system of claim 1, wherein the substrate includes a printed circuit board.

3. The mobile thermal sensor system of claim 1, wherein the substrate includes a flexible circuit board.

4. The mobile thermal sensor system of claim 1, wherein the thermal detector package includes

a first thermopile;

a second thermopile; and

a reference temperature detector.

5. The mobile thermal sensor system of claim 1, wherein the heat spreader includes at least one of aluminum, silicon, or copper.

6. The mobile thermal sensor system of claim 1, wherein the heat spreader includes at least one of carbon, graphite, carbon nanotubes, or carbon nano-fibers.

7. The mobile thermal sensor system of claim 1, wherein the heat spreader is coupled to the substrate on a side opposite the thermal detector package.

8. The mobile thermal sensor system of claim 1, wherein the heat spreader includes

a first thermally conductive layer;

a second insulating layer, and

a third thermally conductive layer.

9. The mobile thermal sensor system of claim 8, wherein the second insulating layer includes at least one of a gaseous medium or a porous medium.

10. The mobile thermal sensor system of claim 9, wherein the gaseous medium includes air.

11. A mobile device case, comprising:

a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system including

a substrate configured to support an electrical component;

a thermal detector package coupled to the substrate, the thermal detector package including

a first thermopile,

a second thermopile, and

a reference temperature detector; and

a first heat spreader coupled to the substrate;

an opening in the case; and

a second heat spreader disposed on the case and proximate to the opening, where the heat spreader is configured to contact the mobile thermal sensor system and disperse heat.

12. The mobile device case of claim 11, wherein the substrate includes a flexible circuit board.

13. The mobile device case of claim 11, wherein the thermal detector package includes

a first thermopile;

a second thermopile; and

a reference temperature detector.

14. The mobile device case of claim 11, wherein at least one of the first heat spreader or the second heat spreader includes at least one of aluminum, silicon, or copper.

15. The mobile device case of claim 11, wherein at least one of the first heat spreader or the second heat spreader includes at least one of carbon, graphite, carbon nanotubes, or carbon nano-fibers.

16. The mobile device case of claim 11, wherein the first heat spreader is coupled to the substrate on a side opposite the thermal detector package.

17. The mobile device case of claim 16, wherein the second insulating layer includes at least one of a gaseous medium.

18. The mobile device case of claim 17, wherein the gaseous medium includes air.

19. A process for fabricating a mobile thermal sensor system, comprising:

reflowing a thermal detector package onto a substrate, where the thermal detector package includes at least a first thermopile, a second thermopile, and a reference temperature detector; and

placing a heat spreader on the substrate.

20. The process for fabricating the mobile thermal sensor system of claim 19, wherein placing the heat spreader on the substrate include placing at least one of an aluminum heat spreader or a copper heat spreader on the substrate.