CHIP COMPONENT AND METHOD OF MANUFACTURING THE SAME

• US 20160307688A1
• Filed: 03/22/2016
• Published: 10/20/2016
• Est. Priority Date: 04/16/2015
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: PARK, Jong Ik
• Application Number:
  US15/077,608
• Publication Number:
  US 20160307688A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder

Abstract

A chip component includes a first body part in which at least one pillar part is formed, a winding coil having a central portion fitted onto the at least one pillar part, and a second body part stacked on the first body part so that the winding coil is embedded between the first body part and the second body part.

Claims

1. A chip component comprising:

a first body part in which at least one pillar part is formed;

a winding coil having a central portion fitted onto the at least one pillar part; and

a second body part stacked on the first body part so that the winding coil is embedded between the first body part and the second body part.

2. The chip component of claim 1, wherein inside the chip component, space surrounding the at least one pillar part but not occupied by the winding coil is completely filled with the second body part.

3. The chip component of claim 1, wherein the pillar part is formed on an upper surface of the first body part, and the second body part is stacked on the upper surface of the first body part.

4. The chip component of claim 1, wherein the first body part has a step between the pillar part onto which the central portion of the winding coil is fitted and a groove part in which the winding coil is seated.

5. The chip component of claim 1, wherein the first body part has strength greater than that of the second body part.

6. The chip component of claim 1, wherein a size of a top portion of the at least one pillar part is less than that of a bottom portion of the one pillar part, the top portion of the at least one pillar part being closer to the second body part than the bottom portion of the at least one pillar part.

7. The chip component of claim 6, wherein an inner size of the winding coil is greater than that of the top portion of the at least pillar part and less than that of the bottom portion of the at least pillar part.

8. The chip component of claim 6, wherein the size of the bottom portion of the at least one pillar part gradually increases in a direction away from the second body part.

9. The chip component of claim 6, wherein the top portion of the at least one pillar part linearly extends towards the bottom portion thereof.

10. The chip component of claim 1, further comprising a plurality of peripheral pillar parts surrounding the at least one pillar part.

11. The chip component of claim 10, wherein a first groove part between two adjacent pillar parts of the plurality of peripheral pillar parts on a first side surface of the first body part, a second groove part between two adjacent pillar parts of the plurality of peripheral pillar parts on a second side surface of the first body part opposing the first side surface thereof, and a third groove part between the at least one pillar part and one of the plurality of peripheral pillar parts on a third side surface of the first body part connecting the first and second side surfaces, are aligned to each other in a direction parallel the third side surface.

12. The chip component of claim 11, wherein the winding coil does not directly contact any of the plurality of peripheral pillar parts.

13. A method of manufacturing a chip component, comprising:

forming at least one pillar part by processing a first body part;

fitting and seating a central portion of a winding coil onto the at least one pillar part;

embedding the winding coil between the first body part and a second body part by adding the second body part; and

compressing and hardening a body part including the first body part and the second body part.

14. The method of claim 13, further comprising forming individual chips by cutting the body part.

15. The method of claim 13, wherein the embedding of the winding coil includes embedding the winding coil between the first body part and the second body part by stacking the second body part on an upper surface of the first body part.

16. The method of claim 13, wherein in the embedding of the winding coil, the second body part is molded in a sheet type and is compressed to the first body part such that the second body part completely fills space surrounding the at least one pillar part but not occupied by the winding coil.

17. The method of claim 13, wherein the forming of the at least one pillar part includes dicing the first body part to form the pillar part onto which the central portion of the winding coil is fitted and a groove part in which the winding coil is seated.

18. The method of claim 17, wherein the forming of the at least one pillar part further includes molding the first body part in a sheet type and hardening the first body part to a predetermined strength so as to be diced.

19. The method of claim 17, wherein the dicing the first body part to form the at least one pillar part partially cuts the first body part in a thickness direction thereof.

20. The method of claim 13, wherein the first body part has strength greater than that of the second body part.