COOLER AND COOLER FIXING METHOD

• US 20160307821A1
• Filed: 04/23/2015
• Published: 10/20/2016
• Est. Priority Date: 06/19/2014
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: MARUYAMA, Ryo
• Granted Patent: US 10,319,665 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10272 : Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/14252 : Voltage converter
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.

Claims

1. A cooler for cooling a semiconductor module to be secured to a base, the cooler comprising:

a cooler body that comprises a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that comprises a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and

a lid for closing off the first through-hole.

2. The cooler according to claim 1, wherein:

a second through-hole is provided in the connection region of the second wall part; and

the cooler further comprises a securing member small enough to be capable of passing through the first through-hole, the securing member being inserted through the second through-hole to secure the cooler body to the base.

3. The cooler according to claim 2, wherein the refrigerant-flow-path-side inner diameter of the second through-hole is greater than the base-side inner diameter thereof.

4. The cooler according to claim 3, wherein:

the securing member is a screw comprising a head part and a screw part; and

a groove is provided to the refrigerant-flow-path side of the second through-hole so as to accommodate the head part of the screw, the groove being arranged such that the head part do not protrude into the refrigerant flow path.

5. The cooler according to claim 2, wherein the cooler further comprises a seal member between the second through-hole and the securing member.

6. The cooler according to claim 1, wherein a wall part is provided in the connection region of the second wall part such that the wall thickness of the wall part is less than the wall thickness in other regions of the second wall part.

7. The cooler according to claim 1, wherein a plurality of fins are connected so as not to block the first through-hole on the refrigerant-flow-path side of the first wall part.

8. The cooler according to claim 1, wherein the lid is formed so as to be detachable from the first wall part.

9. The cooler according to claim 1, wherein the lid is installed so as not to protrude into the refrigerant flow path.

10. The cooler according to claim 1, wherein:

the semiconductor module is to be secured to the outer side of the first wall part; and

the thickness of the first wall part is less than that of the second wall part.

14. The cooler according to claim 3, wherein the cooler further comprises a seal member between the second through-hole and the securing member.

15. The cooler according to claim 4, wherein the cooler further comprises a seal member between the second through-hole and the securing member.

11. A securing method for securing a cooler for cooling a semiconductor module to a base, the method comprising:

a first step for preparing a cooler comprising a cooler body that comprises a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that comprises a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part, the cooler further comprising a lid for closing off the first through-hole;

a second step for positioning the outer side of the second wall part with respect to the base and bringing the second wall part into contact therewith;

a third step for inserting a connection unit through the first through-hole and securing the connection region to the base; and

a fourth step for closing off the first through-hole using the lid.

12. The securing method for securing the cooler according to claim 11, wherein:

in the first step, a cooler having a second through-hole in the connection region of the second wall part is used as the cooler; and

in the third step, a securing member small enough to be capable of passing through the first through-hole and being inserted through the second through-hole to secure the cooler body to the base is used as the connection unit, a securing hole is provided in a portion of the base with which the connection region is in contact, and the securing member is inserted into the cooler through the first through-hole, furthermore inserted through the second through-hole from the inner side of the cooler, and secured in the securing hole in the base.

13. The securing method for securing the cooler according to claim 11, wherein, in the third step, a welding tool is used as the connection unit, and the welding tool is inserted into the cooler through the first through-hole to weld and secure the connection region to the base.