SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate;
an interlayer insulating film formed over the semiconductor substrate; and
a wiring buried in a wiring trench in the interlayer insulating film,wherein the wiring comprises;
a first barrier conductor film formed over the bottom surface and side wall of the wiring trench;
a second barrier conductor film formed over the first barrier conductor film; and
a main conductor film formed over the second barrier conductor film and has copper as a main component,wherein the interlayer insulating film includes a porous low-dielectric-constant insulating film,wherein the first barrier conductor film and the second barrier conductor film has the same conductor material, andwherein the first barrier conductor film has a density lower than that of the second barrier conductor film.
1 Assignment
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Accused Products
Abstract
An object of the invention is to provide a semiconductor device with buried copper wirings having improved reliability. An interlayer insulating film including a porous Low-k film has, in a wiring trench thereof, a wiring. The wiring has a first barrier conductor film formed on the bottom surface and the side wall of the wiring trench, a second barrier conductor film formed on the first barrier conductor film, and a main conductor film formed on the second barrier conductor film and comprised mainly of copper. The first barrier conductor film and the second barrier conductor film are made of the same conductor material but the first conductor film has a density lower than that of the second barrier conductor film.
25 Citations
19 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; an interlayer insulating film formed over the semiconductor substrate; and a wiring buried in a wiring trench in the interlayer insulating film, wherein the wiring comprises; a first barrier conductor film formed over the bottom surface and side wall of the wiring trench; a second barrier conductor film formed over the first barrier conductor film; and a main conductor film formed over the second barrier conductor film and has copper as a main component, wherein the interlayer insulating film includes a porous low-dielectric-constant insulating film, wherein the first barrier conductor film and the second barrier conductor film has the same conductor material, and wherein the first barrier conductor film has a density lower than that of the second barrier conductor film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor device, comprising the steps of:
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(a) forming, over a semiconductor substrate, an interlayer insulating film including a porous low-dielectric-constant insulating film; (b) forming a wiring trench in the interlayer insulating film; (c) forming a first barrier conductor film over the interlayer insulating film including a bottom surface and a side wall of the wiring trench; (d) forming a second barrier conductor film over the first barrier conductor film; (e) forming, over the second barrier conductor film, a main conductor film having copper as a main component so as to fill the wiring trench therewith; and (f) forming a wiring buried in the wiring trench by removing the main conductor film, the second barrier conductor film, and the first barrier conductor film outside the wiring trench and leaving the main conductor film, the second barrier conductor film, and the first barrier conductor film in the ing trench, wherein the first barrier conductor film and the second barrier conductor film have the same conductor material, and wherein the first barrier conductor film has a density lower than that of the second barrier conductor film. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification