PRESSURE SENSOR PACKAGE

• US 20160313201A1
• Filed: 01/07/2016
• Published: 10/27/2016
• Est. Priority Date: 04/23/2015
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Tae Hun, LIM, Chang Hyun, JEONG, Dae Hun
• Application Number:
  US14/990,317
• Publication Number:
  US 20160313201A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means

Abstract

A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.

Claims

1. A pressure sensor package comprising:

a substrate;

a semiconductor circuit disposed on one surface of the substrate and having a reception space open to one surface of the substrate; and

a pressure sensor connected to the substrate and disposed in the reception space.

2. The pressure sensor package of claim 1, wherein a hole is formed in the substrate so that the pressure sensor measures pressure formed on the other surface of the substrate.

3. The pressure sensor package of claim 1, wherein the reception space is longitudinally extended in a length direction of the substrate.

4. The pressure sensor package of claim 1, wherein the semiconductor circuit includes via electrodes connected to circuits of the substrate.

5. The pressure sensor package of claim 1, further comprising

a support member connected to the substrate;

and

a connection member connecting the support member and the pressure sensor to each other.

6. The pressure sensor package of claim 1, wherein the pressure sensor is coupled via a connection member to a support member, the support member including a groove formed substantially along a circumference of the pressure sensor so that the pressure sensor and a support member are separated from each other.

7. The pressure sensor package of claim 1, wherein at least one of the connection member or the support member includes a metal film formed thereon, the metal film configured to enable an electrical connection between the pressure sensor and the substrate.

8. The pressure sensor package of claim 1, further comprising a cover member disposed on one surface of the substrate to substantially cover the semiconductor circuit.

9. The pressure sensor package of claim 1, wherein the semiconductor circuit includes an application specific integrated circuit (ASIC) complementing a function of the pressure sensor.

10. A pressure sensor package comprising:

a substrate having a first reception space formed in one surface thereof;

a semiconductor circuit disposed on one surface of the substrate and having a second reception space formed therein, the second reception space facing the first reception space; and

a pressure sensor connected to the substrate and disposed between the first reception space and the second reception space.

11. The pressure sensor package of claim 10, wherein a hole is formed in the substrate so that the pressure sensor measures pressure formed on the other surface of the substrate.

12. The pressure sensor package of claim 10, wherein the semiconductor circuit includes via electrodes connected to circuits of the substrate.

13. The pressure sensor package of claim 10, further comprising a support member connected to the substrate;

and

a connection member connecting the support member and the pressure sensor to each other.

14. The pressure sensor package of claim 10, wherein the pressure sensor is coupled via a connection member to a support member, the support member including a groove formed substantially along a circumference of the pressure sensor so that the pressure sensor and a support member are separated from each other.

15. The pressure sensor package of claim 10, wherein at least one of the connection member or the support member includes a metal film formed thereon, the metal film configured to enable an electrical connection between the pressure sensor and the substrate.

16. The pressure sensor package of claim 10, further comprising a cover member disposed on one surface of the substrate to substantially cover the semiconductor circuit.

17. The pressure sensor package of claim 10, wherein the semiconductor circuit includes an application specific integrated circuit (ASIC) complementing a function of the pressure sensor.

18. A pressure sensor package comprising:

a substrate; and

,

a pressure sensor mounted in a deformable member disposed on the substrate, the deformable member configured to receive and attenuate mechanical force.

19. The pressure sensor package of claim 18, wherein the substrate has a through-hole defined therethrough and the pressure sensor is mounted thereabove and configured to measure a pressure external thereto.

20. The pressure sensor package of claim 19, wherein the deformable member includes at least one electrical circuit path configured to operably couple the pressure sensor with a connection point on the substrate.