MICROMECHANICAL STRUCTURE FOR AN ACCELERATION SENSOR

• US 20160313365A1
• Filed: 04/19/2016
• Published: 10/27/2016
• Est. Priority Date: 04/27/2015
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ullrich, Guenther-Nino-Carlo
• Application Number:
  US15/132,975
• Publication Number:
  US 20160313365A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/0882 for providing damping of vibrations

Abstract

A micromechanical structure for an acceleration sensor, including a seismic mass which is connected to a substrate with the aid of a central connecting element, a defined number of electrodes situated on the substrate, one spring element being situated on each side of the connecting element in relation to a sensing axis.

Claims

1. A micromechanical structure for an acceleration sensor, comprising:

a seismic mass connected to a substrate with the aid of a central connecting element;

a defined number of electrodes situated on the substrate; and

one spring element situated on each side of the connecting element in relation to a sensing axis.

2. The micromechanical structure as recited in claim 1, wherein at least one damping element is situated on the seismic mass between the two spring elements.

3. The micromechanical structure as recited in claim 1, wherein at least one additional electrode pair is situated on the substrate between the two spring elements.

4. The micromechanical structure as recited in claim 1, wherein a first electric potential is applicable to a first one of the electrodes, a second electric potential is applicable to a second one of the electrodes and a third electric potential is applicable to the connecting element.

5. An acceleration sensor including a micromechanical structure, the micromechanical structure comprising:

a seismic mass connected to a substrate with the aid of a central connecting element;

a defined number of electrodes situated on the substrate; and

one spring element situated on each side of the connecting element in relation to a sensing axis.

6. A method for manufacturing a micromechanical structure for an acceleration sensor, comprising:

forming a substrate including electrodes, provided thereon;

forming a seismic mass;

connecting the seismic mass to the substrate with the aid of a central connecting element; and

forming two spring elements on each side of the connecting element in relation to a sensing axis of the seismic mass.

7. The method as recited in claim 6, wherein first ones of the electrodes are applied to a first electric potential, second ones of the electrodes being applicable to a second electric potential and the connecting element being applicable to a third electric potential.

8. The method as recited in claim 6, wherein at least one additional damping element is situated on the seismic mass between the two spring elements.

9. The method as recited in claim 6, wherein at least two additional electrodes are situated on the substrate between the two spring elements.

10. A micromechanical structure, comprising:

providing a micromechanical structure including a seismic mass connected to a substrate with the aid of a central connecting element, a defined number of electrodes situated on the substrate, and one spring element situated on each side of the connecting element in relation to a sensing axis; and

using the micromechanical structure for a micromechanical acceleration sensor.