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Method of detaching semiconductor material from a carrier and device for performing the method

  • US 20160315012A1
  • Filed: 04/25/2016
  • Published: 10/27/2016
  • Est. Priority Date: 04/27/2015
  • Status: Active Grant
First Claim
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1. A method of detaching semiconductor material from a carrier, the method comprising:

  • providing a carrier having attached thereto a layer of semiconductor material, wherein the layer comprises an edge portion; and

    guiding an air stream onto the edge portion of the layer of semiconductor material.

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