Method of detaching semiconductor material from a carrier and device for performing the method
First Claim
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1. A method of detaching semiconductor material from a carrier, the method comprising:
- providing a carrier having attached thereto a layer of semiconductor material, wherein the layer comprises an edge portion; and
guiding an air stream onto the edge portion of the layer of semiconductor material.
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Abstract
Various embodiments provide a method of detaching semiconductor material from a carrier, wherein the method comprises providing a carrier having attached thereto a layer of semiconductor material, wherein the layer comprises an edge portion; and guiding an air stream onto the edge portion of the layer of semiconductor material.
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Citations
15 Claims
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1. A method of detaching semiconductor material from a carrier, the method comprising:
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providing a carrier having attached thereto a layer of semiconductor material, wherein the layer comprises an edge portion; and guiding an air stream onto the edge portion of the layer of semiconductor material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A device for detaching a semiconductor layer from a carrier, the device comprising:
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a frame configured to mount a carrier; and an air stream unit configured to guide an air stream on edge portions of the mounted elastic carrier. - View Dependent Claims (13, 14, 15)
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Specification