LIGHT EMITTING DEVICE INCLUDING A FILTER AND A PROTECTIVE LAYER

• US 20160315070A1
• Filed: 07/06/2016
• Published: 10/27/2016
• Est. Priority Date: 11/07/2012
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Schricker, April Dawn, Bechtel, Hans-Helmut, Mai, Kim Kevin, Diederich, Thomas, Vogels, Joost Peter Andre, Mackens, Uwe, Heidemann, Matthias
• Granted Patent: US 9,935,244 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method according to embodiments of the invention includes providing a plurality of LEDs attached to a mount. A filter is attached to at least one of the plurality of LEDs. A protective layer is formed over the filter. A reflective layer is formed over the mount. A portion of the reflective layer disposed over the protective layer is removed.

Claims

1. A structure comprising:

a plurality of LEDs attached to a mount;

a wavelength converting layer disposed over the LEDs;

a transparent layer disposed over the wavelength converting layer; and

reflective material disposed between neighboring LEDs;

wherein in an area between neighboring LEDs, the reflective material is in direct contact with a portion of the wavelength converting layer in direct contact with the mount.

2. The structure of claim 1 wherein a top surface of the structure is substantially planar.

3. The structure of claim 2 wherein the top surface comprises a surface of the transparent layer in a portion of the top surface over the LEDs and a surface of the reflective material in a portion of the top surface in regions between the LEDs.

4. The structure of claim 1 wherein a top surface of the transparent layer is roughened, textured, or patterned.

5. The structure of claim 1 wherein the reflective material is in direct contact with a side surface of an LED.

6. A structure comprising:

a plurality of LEDs attached to a mount;

a wavelength converting layer disposed over each LED;

a transparent layer disposed over each wavelength converting layer; and

reflective material disposed between neighboring LEDs;

wherein each wavelength converting layer and each transparent layer is a same width as a top surface of each LED.

7. The structure of claim 6 wherein in an area between neighboring LEDs, the reflective material is in direct contact with a sidewall of the neighboring wavelength converting layers disposed over the neighboring LEDs.

8. The structure of claim 6 wherein in an area between neighboring LEDs, the reflective material is in direct contact with a sidewall of the neighboring transparent layers disposed over the neighboring LEDs.

9. The structure of claim 6 wherein a top surface of the structure is substantially planar.

10. The structure of claim 9 wherein the top surface comprises a surface of the transparent layer in a portion of the top surface over the LEDs and a surface of the reflective material in a portion of the top surface in regions between the LEDs.

11. The structure of claim 6 wherein a top surface of each transparent layer is roughened, textured, or patterned.

12. The structure of claim 6 wherein the reflective material is in direct contact with a side surface of an LED.

13. The structure of claim 6 wherein in an area between neighboring LEDs, the reflective material is in direct contact with the mount.