LIGHT-EMITTING DIODE CHIP
First Claim
1. A light-emitting diode chip, comprisinga semiconductor device layer comprising a first-type doped semiconductor layer, a light-emitting layer, and a second-type doped semiconductor layer, wherein the light-emitting layer is located between the first-type doped semiconductor layer and the second-type doped semiconductor layer;
- a first electrode electrically connected to the first-type doped semiconductor layer;
a current-blocking layer disposed on the second-type doped semiconductor layer;
a current-spreading layer, wherein the current-blocking layer is sandwiched between the current-spreading layer and the second-type doped semiconductor layer, the current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface, and the inclined surface is connected between the first surface and the second surface and tilted with respect to the first surface and the second surface; and
a second electrode disposed on the current-spreading layer and electrically connected to the second-type doped semiconductor layer.
1 Assignment
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Accused Products
Abstract
Provided is a light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second electrode. The semiconductor device layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a light-emitting layer therebetween. The first electrode is electrically connected to the first-type doped semiconductor layer. The current-blocking layer is on the second-type doped semiconductor layer. The current-blocking layer is between the current-spreading layer and the second-type doped semiconductor layer. The second electrode is on the current-spreading layer and electrically connected to the second-type doped semiconductor layer. The current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface. The first inclined surface is connected between the first surface and the second surface and tilted with respect to the first surface and the second surface.
14 Citations
20 Claims
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1. A light-emitting diode chip, comprising
a semiconductor device layer comprising a first-type doped semiconductor layer, a light-emitting layer, and a second-type doped semiconductor layer, wherein the light-emitting layer is located between the first-type doped semiconductor layer and the second-type doped semiconductor layer; -
a first electrode electrically connected to the first-type doped semiconductor layer; a current-blocking layer disposed on the second-type doped semiconductor layer; a current-spreading layer, wherein the current-blocking layer is sandwiched between the current-spreading layer and the second-type doped semiconductor layer, the current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface, and the inclined surface is connected between the first surface and the second surface and tilted with respect to the first surface and the second surface; and a second electrode disposed on the current-spreading layer and electrically connected to the second-type doped semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A light-emitting diode chip, comprising:
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a semiconductor device layer comprising a first-type doped semiconductor layer, a light-emitting layer, and a second-type doped semiconductor layer, wherein the light-emitting layer is located between the first-type doped semiconductor layer and the second-type doped semiconductor layer; a first electrode electrically connected to the first-type doped semiconductor layer; a current-blocking layer disposed on the second-type doped semiconductor layer, wherein the current-blocking layer comprises; at least one first current-blocking sub-layer; and at least one second current-blocking sub-layer, wherein the at least one first current-blocking sub-layer and the at least one second current-blocking sub-layer are stacked alternately; a current-spreading layer, wherein the current-blocking layer is disposed between the current-spreading layer and the second-type doped semiconductor layer; and a second electrode electrically connected to the second-type doped semiconductor layer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification