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SYSTEMS AND METHODS FOR THERMAL LOCATION OF COOLING HOLES

  • US 20160318135A1
  • Filed: 01/13/2015
  • Published: 11/03/2016
  • Est. Priority Date: 01/16/2014
  • Status: Active Grant
First Claim
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1. A method of repairing a component comprising:

  • depositing a material layer on a surface of the component;

    heating the component using a pulsed heat source;

    measuring thermal properties of the component;

    locating a cavity in the component based on the thermal properties; and

    removing a portion of the material layer to expose the cavity.

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