MEMS DEVICE AND METHOD OF MANUFACTURING A MEMS DEVICE
First Claim
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1. A method for manufacturing microelectromechanical systems (MEMS) devices, the method comprising:
- forming a MEMS stack on a first main surface of a substrate;
forming a polymer layer on a second main surface of the substrate; and
forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
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Abstract
A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
5 Citations
22 Claims
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1. A method for manufacturing microelectromechanical systems (MEMS) devices, the method comprising:
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forming a MEMS stack on a first main surface of a substrate; forming a polymer layer on a second main surface of the substrate; and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing microelectromechanical systems (MEMS) devices, the method comprising:
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forming a MEMS stack on a first main surface of a substrate; mounting the MEMS stack on a carrier, the first main surface facing the carrier; thinning the substrate from an opposite main surface to expose a second main surface; depositing a polymer layer on the second main surface of the substrate; and forming a first opening in the polymer layer and the substrate, wherein the first opening is formed directly below the MEMS stack; removing the carrier; and performing a release etch to form moveable components of the MEMS devices after forming the first opening. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification