MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE

• US 20160322562A1
• Filed: 04/27/2016
• Published: 11/03/2016
• Est. Priority Date: 04/29/2015
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Baik-Woo Lee, Young-Jae Kim
• Inventors: JANG, Jae-gwon, LEE, Baik-woo, KIM, Young-jae
• Granted Patent: US 10,074,799 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48108 the connector not being orthogonal to a side surface of the semiconductor or solid-state body, e.g. fanned-out connectors, radial layout
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/4912 Layout
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/049 the other leads being perpendicular to the base
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/14 characterised by the material or its electrical properties printed circuit boards H05K1/00
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1443 : Non-volatile random-access memory [NVRAM]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H10N 50/01 : Manufacture or treatment
• CPC Class Codes: H10N 50/10 : Magnetoresistive devices

Abstract

In one embodiment, a magneto-resistive chip package includes a circuit board; a shielding body including a shielding base part positioned on the circuit board and a shielding intermediate part extending from one side of the shielding base part; a magneto-resistive chip positioned on the shielding base part and including a magneto-resistive cell array; an internal connection part electrically connecting the magneto-resistive chip to the circuit board; an encapsulation part encapsulating the magneto-resistive chip on the circuit board, and having an upper surface that is higher than an upper surface of the magneto-resistive chip; and a shielding cover positioned on the shielding intermediate part, and on the encapsulation part.

Claims

1. A magneto-resistive chip package comprising:

a circuit board;

a shielding body comprising a shielding base part positioned on the circuit board and a shielding intermediate part extending from one side of the shielding base part;

a magneto-resistive chip positioned on the shielding base part;

an internal connection part electrically connecting the magneto-resistive chip to the circuit board;

an encapsulation part encapsulating the magneto-resistive chip on the circuit board; and

a shielding cover positioned on the shielding intermediate part and on the encapsulation part.

3. The magneto-resistive chip package of claim 1, wherein the shielding intermediate part is comprised of a plurality of columns spaced apart from each other on one side of the shielding base part.

4. The magneto-resistive chip package of claim 1, wherein the shielding intermediate part comprises a single contiguous wall extending substantially entirely along one side of the shielding base part.

7. The magneto-resistive chip package of claim 1, wherein an upper surface of the shielding intermediate part is higher than the upper surface of the magneto-resistive chip.

9. The magneto-resistive chip package of claim 1, wherein the shielding cover is disposed over substantially the entire area of the circuit board by further extending beyond edge portions of the shielding base part and the shielding intermediate part.

10. The magneto-resistive chip package of claim 1, wherein the shielding base part, the shielding intermediate part, and the shielding cover constitute a shielding structure for protecting the magneto-resistive cell array of the magneto-resistive chip, wherein the shielding structure is a single layer of a magnetic material layer or a laminating layer in which a plurality of magnetic material layers, and wherein a plurality of non-magnetic material layers are sequentially stacked.

11. The magneto-resistive chip package of claim 1, further comprising an adhesion layer including a magnetic material positioned on the upper surface of the encapsulation part and on an upper surface of the shielding intermediate part, and wherein the shielding cover is positioned on the adhesion layer including the magnetic material.

15. The magneto-resistive chip package of claim 1, wherein the internal connection part comprise bonding wires that electrically connect the magneto-resistive chip to the circuit board.

16. The magneto-resistive chip package of claim 1, wherein the shielding base part and the circuit board are connected to each other through a ground connection part.

17. The magneto-resistive chip package of claim 1, wherein ends of the shielding cover extend past opposite edges of the shielding intermediate part.

2. (canceled)

5. (canceled)

6. (canceled)

8. (canceled)

12-14. -14. (canceled)

18. A magneto-resistive chip package comprising:

a circuit board;

a shielding body arranged on the circuit board, the shielding body comprising a shielding base part and a shielding intermediate part extending from one side of the shielding base part, the shielding body having an opening formed through the shielding base part or through the shielding intermediate part;

a magneto-resistive chip arranged on the shielding base part; and

an internal connection part electrically connecting the magneto-resistive chip to the circuit board through the opening.

19. The package of claim 18, further comprising an encapsulation part encapsulating the magneto-resistive chip on the circuit board.

20. The package of claim 19, further comprising:

a shielding cover positioned on the shielding intermediate part.

21. The package of claim 20, wherein the shielding cover is positioned on the encapsulation part.

22. The package of claim 21, wherein the shielding cover covers the internal connection part.

23. The package of claim 22, wherein the shielding intermediate part comprises a plurality of columns spaced apart from each other, and wherein the opening is defined between the plurality of columns.

24-37. -37. (canceled)

38. A magneto-resistive chip package comprising:

a circuit board;

a shielding base part positioned on the circuit board and having a penetration hole through which the circuit board is exposed;

a magneto-resistive chip positioned on the shielding base part;

a shielding intermediate part provided on one side of the shielding base part and protruding higher than an upper surface of the magneto-resistive chip;

an internal connection part electrically connecting the magneto-resistive chip to the circuit board through the penetration hole;

an encapsulation part encapsulating the magneto-resistive chip on the circuit board; and

a shielding cover positioned on the shielding intermediate part and on the encapsulation part.

39. The magneto-resistive chip package of claim 38, wherein the penetration hole is positioned on one side of the shielding base part, and wherein the internal connection part comprises bonding wires that electrically connect the magneto-resistive chip to the circuit board.

40. The magneto-resistive chip package of claim 38, wherein the penetration hole is positioned on one side of the shielding base part, wherein the magneto-resistive chip comprises a contact electrode as the internal connection part, and wherein the contact electrode is electrically connected to the circuit board through the penetration hole.

41. The magneto-resistive chip package of claim 38, wherein a plurality of the penetration holes are provided around a periphery of the shielding base part.

42-59. -59. (canceled)