HIGH-FREQUENCY MODULE

• US 20160322956A1
• Filed: 07/08/2016
• Published: 11/03/2016
• Est. Priority Date: 01/10/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: TAKEUCHI, Morio, KAWASAKI, Koichiro, KONAKA, Yohei
• Granted Patent: US 10,128,816 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H03H 7/09 Filters comprising mutual inductance
• CPC Class Codes: H03H 9/0009 using surface acoustic wave devices
• CPC Class Codes: H03H 9/0542 consisting of a lateral arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/6433 Coupled resonator filters
• CPC Class Codes: H03H 9/6483 Ladder SAW filters
• CPC Class Codes: H03H 9/725 Duplexers
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/1006 Non-printed filter

Abstract

In a high frequency module, in addition to a main transmission path in which a high-frequency signal propagates in first filter elements, a sub transmission path is defined by inductive coupling or capacitive coupling between a first inductor and a matching element or by inductive coupling between the first inductor and a second inductor. The sub transmission path has different amplitude characteristics and phase characteristics from those of the main transmission path depending on a degree of the inductive coupling or capacitive coupling, and transmission characteristics as a high-frequency module are adjustable by adjusting the amplitude characteristics and the phase characteristics of the sub transmission path.

Claims

1. A high-frequency module comprising:

a first external connection terminal;

a second external connection terminal;

a filter section connected between the first external connection terminal and the second external connection terminal; and

a matching element connected between the filter section and at least one of the first external connection terminal and the second external connection terminal;

wherein

the filter section includes;

a first connection terminal connected to the first external connection terminal;

a second connection terminal connected to the second external connection terminal;

a plurality of first filter elements connected in series between the first connection terminal and the second connection terminal; and

a first inductor;

wherein

the first inductor is inductively coupled or capacitively coupled to the matching element, and the first inductor is connected in parallel to a first filter element, among the plurality of the first filter elements, that is different from the first filter element connected to the matching element.

3. The high-frequency module according to claim 1, wherein the filter section includes:

a fourth connection terminal; and

a fifth connection terminal;

wherein

the first inductor is connected in parallel to the first filter element through the fourth connection terminal and the fifth connection terminal.

4. The high-frequency module according to claim 1, wherein inductive coupling or capacitive coupling produced by the first inductor changes impedance outside a pass band of the filter section.

5. The high-frequency module according to claim 1, wherein inductive coupling or capacitive coupling produced by the first inductor changes an attenuation pole frequency outside a pass band of the filter section.

6. The high-frequency module according to claim 1, wherein the matching element is a series-connected matching element connected in series between the first external connection terminal and the first connection terminal or connected in series between the second external connection terminal and the second connection terminal.

7. The high-frequency module according to claim 1, wherein the matching element is a shunt-connected matching element connected between a ground and a connection line connecting the first external connection terminal and the first connection terminal or connected between a ground and a connection line connecting the second external connection terminal and the second connection terminal.

9. The high-frequency module according to claim 1, wherein

the filter section includes a sixth connection terminal and a second filter section;

and

the second filter section is connected between the sixth connection terminal and a connection line connecting the first connection terminal and the first filter element, or is connected between the sixth connection terminal and a connection line connecting the second connection terminal and the first filter element.

10. The high-frequency module according to claim 1, wherein

the filter section includes an interdigital transducer electrode;

the high-frequency module further comprises;

a planar filter substrate in which the interdigital transducer electrode is provided on a first main surface;

a planar cover layer that opposes the first main surface of the filter substrate with a gap between the cover layer and the first main surface;

a connection electrode that protrudes from the first main surface and passes through the cover layer; and

a multilayer substrate where the first inductor is mounted or located; and

the filter substrate is disposed so that the first main surface side of the filter substrate faces a mounting surface of the multilayer substrate; and

the filter substrate is connected to the multilayer substrate through the connection electrode.

11. The high-frequency module according to claim 10, wherein

the matching element includes a mounted circuit element mounted on the mounting surface of the multilayer substrate;

the first inductor is mounted on the mounting surface of the multilayer substrate or located within the multilayer substrate; and

the mounted circuit element and the first inductor are disposed nearby each other.

12. The high-frequency module according to claim 11, wherein the mounted circuit element is directly adjacent to the first inductor.

13. The high-frequency module according to claim 1, wherein the first inductor and the matching element are located such that there is no other element or a wiring pattern provided therebetween.

14. The high-frequency module according to claim 1, wherein

the filter section includes an interdigital transducer electrode;

the high-frequency module further comprises;

a planar filter substrate in which the interdigital transducer electrode is provided on a first main surface;

a planar cover layer that opposes the first main surface of the filter substrate with a gap between the cover layer and the first main surface;

a connection electrode that protrudes from the first main surface and passes through the cover layer; and

a multilayer substrate;

wherein

the filter substrate is disposed so that the first main surface side of the filter substrate faces a mounting surface of the multilayer substrate;

the filter substrate is connected to the multilayer substrate through the connection electrode; and

the matching element includes a mounted circuit element mounted on the mounting surface of the multilayer substrate;

the first inductor is provided within the cover layer; and

the mounted circuit element and the first inductor are disposed nearby each other.

15. The high-frequency module according to claim 11, wherein the matching element includes:

a rectangular or substantially rectangular parallelepiped housing; and

a spiral conductor, provided within the housing, that has a rectangular or substantially rectangular outer circumferential shape when seen in plan view;

wherein

the matching element is disposed so that a long side of the housing is nearby the first inductor.

16. The high-frequency module according to claim 1, wherein

the filter section includes an interdigital transducer electrode;

the high-frequency module further comprises;

a planar filter substrate in which the interdigital transducer electrode includes a first main surface; and

a planar filter mounting substrate, disposed on the first main surface side of the filter substrate, to which the filter substrate is mounted on the first main surface side; and

the matching element is mounted on, mounted in, formed on, or formed in the mounting surface of the filter mounting substrate.

17. The high-frequency module according to claim 10, wherein

the matching element is a matching inductor connected in parallel to an antenna;

and

the matching inductor and the first inductor are provided within the multilayer substrate so as to be nearby each other.

18. The high-frequency module according to claim 17, wherein

the matching inductor and the first inductor are linear electrodes provided on mutually different layers of the multilayer substrate;

the linear electrode that defines the matching inductor includes an overlapping portion that overlaps with the linear electrode that defines the first inductor when viewed in a laminating direction of the multilayer substrate.

19. The high-frequency module according to claim 18, wherein the linear electrode that defines the matching inductor and the linear electrode that defines the first inductor have opposite high-frequency signal transmission directions in the overlapping portion.

20. The high-frequency module according to claim 10, wherein

the matching element includes a matching inductor connected in series to an antenna;

and

the matching inductor and the first inductor are provided within the multilayer substrate so as to be nearby each other.

21. The high-frequency module according to claim 20, wherein

the matching inductor and the first inductor are linear electrodes provided on mutually different layers of the multilayer substrate;

the linear electrode that defines the matching inductor includes an overlapping portion that overlaps with the linear electrode that defines the first inductor when viewed in a laminating direction of the multilayer substrate.

22. The high-frequency module according to claim 21, wherein the linear electrode that defines the matching inductor and the linear electrode that defines the first inductor have opposite high-frequency signal transmission directions in the overlapping portion.

2. A high-frequency module comprising:

a first external connection terminal;

a second external connection terminal;

a filter section connected between the first external connection terminal and the second external connection terminal; and

a matching element connected between the filter section and at least one of the first external connection terminal and the second external connection terminal;

wherein

the filter section includes;

a first connection terminal connected to the first external connection terminal;

a second connection terminal connected to the second external connection terminal;

a third connection terminal connected to a ground;

a plurality of first filter elements connected in series between the first connection terminal and the second connection terminal; and

a second filter element connected at one end to a connection line connecting the first connection terminal and at least one of the first filter elements, a connection line connecting the second connection terminal and at least one of the first filter elements, or a connection line connecting mutually-adjacent first filter elements, and connected at another end to the third connection terminal;

wherein

the high-frequency module further includes a first inductor connected in parallel to the first filter element; and

a second inductor connected between the third connection terminal and the ground; and

the first inductor and the second inductor are inductively coupled.

8. The high-frequency module according to claim 2, further comprising:

a third filter element connected at one end to a connection line aside from the connection line to which the one end of the second filter element is connected, and connected at another end to the third connection terminal.