Suspended Track and Planar Electrode Systems and Methods

• US 20160327222A1
• Filed: 07/18/2016
• Published: 11/10/2016
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Apex Technologies Inc.
• Original Assignee: Apex Technologies Inc.
• Inventors: Rudisill, Charles Albert, Whittle, Daniel John
• Granted Patent: US 10,132,452 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21V 21/008 Suspending from a cable or suspension line
• CPC Class Codes: F21V 21/096 Magnetic devices
• CPC Class Codes: F21V 21/35 with direct electrical contact between the supporting element and electric conductors running along the guiding element
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

Suspended and planar electrode systems and methods are disclosed for applications such as lighting. Some embodiments incorporate removable twist-on elements providing uniform spacing between cable rod or strip electrodes extending through space. Multiple electrodes may be attached simultaneously. Twist-on elements may contain light emitting elements electrically attached to parallel electrodes. Embodiments may include mounting features for fixing electrodes above a mounting surface. Some embodiments include electrically insulated electrodes and modules with insulation displacement contact elements and environmental sealing. Some embodiments include polymeric insulation on both the module and electrodes providing environmental sealing when modules are disconnected from electrodes. Electrodes in sealed systems may be suspended with spacers or built into planar arrays in walls, ceiling or furniture. Some embodiments include folded electrode gyrating tracks having mounting positions providing different axial and radial pointing directions. Modules may be attached to electrodes by mechanical or magnetic forces.

Claims

1. ) An electrode and module system for electrical attachment comprising:

an electrode comprising an attachment surface,

a module having top and bottom surfaces wherein the bottom surface comprises an electrical contact pad configured to make an electrical connection to the electrode attachment surface,

an attachment force directed substantially perpendicular to the electrode attachment surface,

an insulating layer located between the bottom surface of the module and the electrode surface when the module is attached to the electrode,

one or more electrically conducting spikes capable of piercing the insulating layer to make electrical continuity between the electrode and the contact pad when the attachment force is applied, and

sealing means for protecting the electrical connection from environmental contamination, wherein the sealing means is compressed in a direction perpendicular to the attachment surface and a portion of the bottom surface of the module around the one or more spikes when the attachment force is applied.

2. ) The electrode and module system for electrical attachment of claim 1 wherein the sealing means comprises the insulating layer.

3. ) The electrode and module system for electrical attachment of claim 1 wherein the sealing means comprises a gasket surrounding the spike.

4. ) The electrode and module system for electrical attachment of claim 1 wherein the electrode comprises a ferromagnetic material and wherein the module comprises a permanent magnet and wherein the attachment force is a magnetic force.

5. ) The electrode and module system for electrical attachment of claim 4 wherein the module further comprises one or more ferromagnetic pole pieces arranged to provide a complete flux circuit including the permanent magnet, the one or more pole pieces and the electrode and wherein the magnetic flux is substantially perpendicular to the electrode surface proximate the electrical contact.

6. ) The electrode and module system for electrical attachment of claim 5 comprising an insulating substrate wherein the electrode is supported by the substrate.

7. ) A system for environmental sealing of an electrical connection between a module and an electrode surface comprising:

one or more insulation displacement spikes,

one or more insulating layers wherein the insulating layers comprise compressible material,

wherein the insulating layers are compressed in a direction substantially perpendicular to the electrode surface when the module is electrically connected to the electrode surface and wherein the compressed insulating layers provide environmental sealing surrounding the one or more insulation displacement spikes between the module and electrode surface.

8. ) The electrode and module system for electrical attachment of claim 7 wherein the system comprises at least two electrodes oriented parallel to each other.

9. ) The electrode and module system for electrical attachment of claim 8 further comprising a spacer means for maintaining the electrodes in a locally parallel configuration.

10. ) The electrode and module system for electrical attachment of claim 9 wherein the spacer means is attached to the electrodes through rotation about an axis perpendicular to the linear axis of the electrodes.

11. ) The electrode and module system for electrical attachment of claim 9 wherein the electrode surfaces for connection are located on opposite sides of a strip track.

12. ) An insulation displacement connection system for attaching a module to an electrode system comprising:

a module comprising

a top surface and a bottom surface, the bottom surface having one or more electrical contact pads wherein the electrical contact pads comprise one or more insulation displacement spikes,

a module insulating layer covering an electrical contact pad,

a light-emitting device capable of emitting light from the top surface when supplied with electrical power from the electrode,

an electrode comprising

an attachment surface for electrical connection to the module, and

an electrode insulating layer wherein the electrode insulating layer covers the attachment surface;

an attachment force for mechanically and electrically attaching the module to the electrode system wherein the one or more insulation displacement spikes pierce the module insulating layer and the electrode insulating layer when the attachment force is applied in a direction perpendicular to the electrode attachment surface and wherein

the attachment force presses the module insulating layer against the electrode insulating layer to provide environmental sealing.

13. ) The electrode and module system for electrical attachment of claim 12 wherein the module insulating layer and the electrode insulating layer do not move relative to each other during the attachment process in a direction parallel to the attachment surface.

14. ) The electrode and module system for electrical attachment of claim 12 further comprising an IDC plate wherein the IDC spikes are formed on the IDC plate.

15. ) The electrode and module system for electrical attachment of claim 12 comprising at least two electrodes wherein the at least two electrodes are separated by a fixed spacing to form a locally parallel track.

16. ) The electrode and module system for electrical attachment of claim 12 wherein the at least two electrodes are held in position by spacer means and wherein the spacer means is attached to the electrodes by rotation of at least a portion of the spacer means in a direction perpendicular to the longitudinal axis of the track.

17. ) The electrode and module system for electrical attachment of claim 12 wherein the track is folded to produce positive and negative surface fold angles having positive and negative fold line angles relative to the longitudinal axis of the track to produce a gyrating track.

18. ) The electrode and module system for electrical attachment of claim 17 wherein the light emitted from the module points in different axial and radial directions when attached to different locations on the gyrating track.

19. ) The electrode and module system for electrical attachment of claim 14 wherein the IDC plate is removably attached to the module.