SPLIT POLY CONNECTION VIA THROUGH-POLY-CONTACT (TPC) IN SPLIT-GATE BASED POWER MOSFETS

• US 20160329426A1
• Filed: 07/19/2016
• Published: 11/10/2016
• Est. Priority Date: 04/23/2014
• Status: Active Grant

• Current Assignee: Alpha & Omega Semiconductor, Ltd.
• Original Assignee: Alpha & Omega Semiconductor, Ltd.
• Inventors: Kim, Jongoh, Lee, Yeeheng, Lui, Sik, Chang, Hong, Bobde, Madhur, Guan, Lingpeng, Yilmaz, Hamza
• Granted Patent: US 9,818,829 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/28008 Making conductor-insulator-semiconductor electrodes
• CPC Class Codes: H01L 21/28114 characterised by the sectional shape, e.g. T, inverted-T
• CPC Class Codes: H01L 27/0255 using diodes as protective elements
• CPC Class Codes: H01L 27/0266 using field effect transistors as protective elements
• CPC Class Codes: H01L 29/40114 the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/4236 within a trench, e.g. trench gate electrode, groove gate electrode
• CPC Class Codes: H01L 29/42364 characterised by the insulating layer, e.g. thickness or uniformity H01L29/42324 and H01L29/4234 take precedence
• CPC Class Codes: H01L 29/42376 characterised by the length or the sectional shape
• CPC Class Codes: H01L 29/66666 Vertical transistors H01L29/66712, H01L29/66742 take precedence
• CPC Class Codes: H01L 29/66734 with a step of recessing the gate electrode, e.g. to form a trench gate electrode
• CPC Class Codes: H01L 29/7803 structurally associated with at least one other device assemblies H01L25/00; integrated circuits H01L27/00
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236
• CPC Class Codes: H01L 29/7827 Vertical transistors H01L29/7802, H01L29/78642 take precedence

Abstract

Embodiments of the present disclosure provide a contact structure in a split-gate trench transistor device for electrically connecting the top electrode to the bottom electrode inside the trench. The transistor device comprises a semiconductor substrate and one or more trenches formed in the semiconductor substrate. The trenches are lined with insulating materials along the sidewalls inside the trenches. Each trench has a bottom electrode in lower portions of the trench and a top electrode in its upper portions. The bottom electrode and the top electrode are separated by an insulating material. A contact structure filled with conductive materials is formed in each trench in an area outside of an active region of the device to connect the top electrode and the bottom electrode. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Claims

1. A transistor device, comprising:

a semiconductor substrate;

a plurality of trenches formed in the semiconductor substrate, each trench being lined with an insulating material along sidewalls inside the trench, each trench having a bottom conductive material in lower portions of the trench and a top conductive material in an upper portion of the trench, wherein the bottom conductive material and the top conductive material are separated by an inter-electrode insulating layer; and

a plurality of contact structures formed in the plurality of trenches respectively in an area outside of an active region of the device, each contact structure being filled with conductive materials, wherein each contact structure penetrates through a portion of the top conductive material and the inter-electrode insulating layer beneath the top conductive material to reach the bottom electrode.

2. The device of claim 1, further comprising one or more insulating structure configured to electrically isolate a portion of the top conductive material from electrical contact with the bottom conductive material.

3. The device of claim 2, wherein the one or more insulating structures are formed near the contact structures and is filled with insulating materials.

4. The device of claim 1, wherein each of the contact structures is filled with tungsten, polysilicon and/or other conductive materials.

5. The device of claim 1, wherein the insulating material lined along sidewalls in the upper portions of each trench has a thickness less than that of the insulating material lined along sidewalls in its lower portions.