MULTILAYER STRUCTURE AND TOUCH PANEL MODULE

• US 20160334896A1
• Filed: 07/25/2016
• Published: 11/17/2016
• Est. Priority Date: 02/19/2014
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: NISHIDA, Tetsuji, TSUBATA, Hisashi, KOIKE, Takashi, KOBAYASHI, Hiroyuki
• Application Number:
  US15/218,518
• Publication Number:
  US 20160334896A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 15/02 Layer formed of wires, e.g. mesh
• CPC Class Codes: B32B 15/082 comprising vinyl resins; comprising acrylic resins
• CPC Class Codes: B32B 15/085 comprising polyolefins
• CPC Class Codes: B32B 15/088 comprising polyamides
• CPC Class Codes: B32B 15/09 comprising polyesters
• CPC Class Codes: B32B 21/00 Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/205 Metallic coating
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/30 having particular thermal properties
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2457/208 Touch screens
• CPC Class Codes: B32B 2571/00 Protective equipment
• CPC Class Codes: B32B 2603/00 Vanes, blades, propellers, rotors with blades
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/306 comprising vinyl acetate or vinyl alcohol (co)polymers
• CPC Class Codes: B32B 27/325 comprising polycycloolefins
• CPC Class Codes: B32B 27/34 comprising polyamides
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 27/365 comprising polycarbonates
• CPC Class Codes: B32B 7/12 : using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06F 2203/04102 : Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 2203/04103 : Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04112 : Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/041 : Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 : using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 : using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A multilayer structure has a laminate including a transparent conductive member having a conductive pattern having a mesh structure composed of thin metal wires on a transparent substrate having flexibility, a protective member for protecting the transparent conductive member, and an optically transparent adhesive layer disposed between the transparent conductive member and the protective member. The thickness of the laminate is 100 μm or more and 600 μm or less. The thickness of the adhesive layer is 20% or more of the thickness of the laminate. The thermal shrinkage of the transparent conductive member at 150° C. is 0.5% or less, and a difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protective member at 150° C. is within 60% of the thermal shrinkage of the transparent conductive member at 150° C. The multilayer structure is used for a touch panel module having a three-dimensional shape.

Claims

1. A multilayer structure comprising:

a laminate comprising

a transparent conductive member having a conductive pattern having a mesh structure composed of thin metal wires on a transparent substrate having flexibility,

a protective member for protecting the transparent conductive member, and

an optically transparent adhesive layer disposed between the transparent conductive member and the protective member,

wherein the thickness of the laminate is 100 μ

m or more and 600 μ

m or less,

the thickness of the adhesive layer is 20% or more of the thickness of the laminate,

the thermal shrinkage of the transparent conductive member at 150°

C. is 0.5% or less, and

a difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protective member at 150°

C. is within 60% of the thermal shrinkage of the transparent conductive member at 150°

C.

2. The multilayer structure according to claim 1,

wherein the protective member is disposed on the side of the transparent conductive member which the thin metal wires are provided.

3. The multilayer structure according to claim 2,

wherein the conductive pattern is formed on both surfaces of the transparent substrate.

4. The multilayer structure according to claim 2,

wherein the conductive pattern is formed on one surface of the transparent substrate.

5. The multilayer structure according to claim 4,

wherein the protective member is further provided on the side opposite to the side of the transparent conductive member in which the thin metal wires are provided, and the adhesive layer is disposed between the transparent conductive member and the protective member on the opposite side.

6. The multilayer structure according to claim 1,

wherein the laminate has a three-dimensional shape.

7. The multilayer structure according to claim 2,

wherein the laminate has a three-dimensional shape.

8. The multilayer structure according to claim 3,

wherein the laminate has a three-dimensional shape.

9. The multilayer structure according to claim 4,

wherein the laminate has a three-dimensional shape.

10. The multilayer structure according to claim 5,

wherein the laminate has a three-dimensional shape.

11. A touch panel module comprising:

the multilayer structure according to claim 1.

12. A touch panel module comprising:

the multilayer structure according to claim 2.

13. A touch panel module comprising:

the multilayer structure according to claim 3.

14. A touch panel module comprising:

the multilayer structure according to claim 4.

15. A touch panel module comprising:

the multilayer structure according to claim 5.

16. A touch panel module comprising:

the multilayer structure according to claim 6.

17. A touch panel module comprising:

the multilayer structure according to claim 7.

18. A touch panel module comprising:

the multilayer structure according to claim 8.

19. A touch panel module comprising:

the multilayer structure according to claim 9.

20. A touch panel module comprising:

the multilayer structure according to claim 10.