ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME

• US 20160336646A1
• Filed: 05/04/2016
• Published: 11/17/2016
• Est. Priority Date: 05/11/2015
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: BAEK, Kwang-Hyun, HONG, Won-Bin
• Granted Patent: US 10,490,879 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/243 with built-in antennas

Abstract

An antenna device and an electronic device including the antenna device are provided. The antenna device includes a radio frequency (RF) module and a baseband (BB) module. The RF module includes first radiating conductors and a radio frequency integrated chip (RFIC) integrated with the first radiating conductors. The BB module includes second radiating conductors respectively corresponding to some of the first radiating conductors and a baseband integrated chip (BBIC) integrated with the second radiating conductors. The RF module may be combined with the BB module via a cable or be positioned facing the BB module to be electrically connected with the BB module.

Claims

1. An antenna device comprising:

a radio frequency (RF) module comprising;

a plurality of first radiating conductors; and

an RF integrated chip (RFIC) integrated with the first radiating conductors; and

a baseband (BB) module comprising;

a plurality of second radiating conductors respectively corresponding to some of the first radiating conductors; and

a BB integrated chip (BBIC) integrated with the second radiating conductors, wherein the RF module is combined with the BB module via a cable or positioned facing the BB module to be electrically connected with the BB module.

2. The antenna device of claim 1, wherein, when the RF module is combined with the BB module to be positioned facing the BB module, some of the first radiating conductors corresponding to the second radiating conductors are provided as soldering pads.

3. The antenna device of claim 2, wherein the second radiating conductors receive electricity from the RFIC via one of the first radiating conductors respectively provided as the soldering pads.

4. The antenna device of claim 3, wherein the second radiating conductors are arranged on a surface positioned opposite the RF module to form broadside radiation.

5. The antenna device of claim 3, wherein at least some of the second radiating conductors are arranged on a side surface of the BB module or parallel with the side surface thereof to form endfire radiation.

6. The antenna device of claim 1,

wherein the RF module further comprises a circuit board having a first surface positioned facing the BB module;

wherein some of the first radiating conductors arranged on the first surface and first via holes formed through the circuit board and respectively connected with the first radiating conductors on the first surface; and

wherein the first radiating conductors on the first surface receive electricity through the first via holes.

7. The antenna device of claim 6, wherein, when the RF module is combined with the BB module to be positioned facing the BB module,

the first radiating conductors arranged on the first surface are provided as the soldering pads, and

the second radiating conductors receive electricity from the RFIC via one of the first radiating conductors respectively provided as the soldering pads.

8. The antenna device of claim 6, wherein the RF module further comprises:

a plurality of second via holes formed through the circuit board;

wherein the second via holes are arranged around the first via holes to provide a ground.

9. The antenna device of claim 6, wherein the RF module further comprises:

a conductive layer formed on, at least, the first surface of the circuit board; and

a plurality of slots formed in the conductive layer;

wherein some of the first radiating conductors are arranged in the slots.

10. The antenna device of claim 9, wherein the RF module further comprises:

a plurality of second via holes formed through the circuit board;

wherein the second via holes are arranged around the first via holes, and the second via holes, together with the conductive layer, provide a ground.

11. The antenna device of claim 1, wherein the RF module further comprises:

a circuit board having a conductive layer formed on at least a surface thereof; and

a plurality of slots formed in the conductive layer;

wherein some of the first radiating conductors are arranged in the slots.

12. The antenna device of claim 1, wherein the BB module further comprises:

a circuit board including a conductive layer formed on, at least, a surface thereof, which is positioned opposite the RF module; and

a plurality of slots formed in the conductive layer;

wherein the second radiating conductors are arranged in the slots.

13. The antenna device of claim 1, wherein the RF module comprises:

a circuit board including a plurality of layers;

a plurality of conductors arranged on at least one of a surface or opposite surface of each of the layers; and

a plurality of via holes formed through the layers to connect the conductors arranged on different surfaces of the layers to form a mesh grid structure; and

wherein at least one of the first radiating conductors is implemented with the conductors and the via holes to form the mesh grid structure.

14. The antenna device of claim 13, wherein the first radiating conductor implemented with the conductors and the via holes forms endfire radiation.

15. The antenna device of claim 13, wherein the RF module further comprises:

soldering pads provided on a surface of the circuit board and the soldering pads being connected with the first radiating conductors;

wherein, when the RF module is combined with the BB module to be positioned facing the BB module, the second radiating conductors receive electricity from the RFIC through the soldering pads.

16. The antenna device of claim 1, wherein the BB module comprises a circuit board, the circuit board comprising:

a plurality of layers;

a plurality of conductors arranged on at least one of a surface or opposite surface of each of the layers; and

a plurality of via holes formed through the layers for connecting the conductors arranged on different surfaces of the layers to form a mesh grid structure; and

wherein at least one of the second radiating conductors is implemented with the conductors and the via holes to form the mesh grid structure.

17. The antenna device of claim 16, wherein the at least one of the second radiating conductors, implemented with the conductors and the via holes, receives electricity from the RFIC to form endfire radiation.

18. An electronic device comprising:

an antenna device comprising;

a radio frequency (RF) module comprising;

a plurality of first radiating conductors; and

an radio frequency RF integrated chip (RFIC) integrated with the first radiating conductors; and

a baseband (BB) module comprising;

second radiating conductors respectively corresponding to some of the first radiating conductors; and

a BB integrated chip (BBIC) integrated with the second radiating conductors, wherein the RF module is combined with the BB module via a cable or to be positioned facing the BB module to be electrically connected with the BB module.

19. The electronic device of claim 18, wherein, when the RF module is combined with the BB module to be positioned facing the BB module, some of the first radiating conductors corresponding to the second radiating conductors are provided as soldering pads.

20. The electronic device of claim 18,

wherein the RF module further comprises a circuit board having a first surface positioned facing the BB module;

wherein some of the first radiating conductors arranged on the first surface and first via holes formed through the circuit board and respectively connected with the first radiating conductors on the first surface; and

wherein the first radiating conductors on the first surface receive electricity through the first via holes.