PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE

• US 20160343634A1
• Filed: 08/01/2016
• Published: 11/24/2016
• Est. Priority Date: 03/16/2011
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Synaptics Incorporated
• Inventors: Erhart, Richard Alexander, Nelson, Richard Brian
• Granted Patent: US 9,754,852 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER

Abstract

A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Claims

1. A method of fabricating a biometric object sensor by forming an integrated circuit driving the sensor between a sensing side of an encapsulating package and a molded filler material at least partly encapsulating the integrated circuit.

2. A method of fabricating a biometric object sensor wafer level fan out package comprising:

forming a sensor control integrated circuit;

forming a molded fill material formed to at least partially encapsulate the integrated circuit;

forming sensor element metal traces electrically connected to the integrated circuit on the sensing side of the package;

forming at least one ball grid array electrical connector mounted on a connection side of the package; and

forming a protective coating on the sensing side of the package over the sensor element metal traces.

3. The method of claim 2 wherein the molded fill material completely encapsulates the integrated circuit.

4. The method of claim 2 further comprising:

connecting the ball grid array electrical connector to the sensing side of the package through a through mold via.

5. The method of claim 2 wherein the connection side of the package comprises a printed circuit board intermediate the at least one ball grid array electrical connector and the integrated circuit.

6. The method of claim 2 further comprising, forming the molded fill material in an opening in a printed circuit board containing the integrated circuit.

7. The method of claim 2 wherein the biometric object is a finger.