MEMS Packages and Methods of Manufacture Thereof
First Claim
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1. A method of manufacturing a microelectromechanical systems (MEMS) package, the method comprising:
- attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and
singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages.
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Abstract
Microelectromechanical systems (MEMS) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a MEMS package may include attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages.
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20 Claims
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1. A method of manufacturing a microelectromechanical systems (MEMS) package, the method comprising:
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attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a microelectromechanical systems (MEMS) package, the method comprising:
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coupling a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices to form a wafer level MEMS package; after the coupling, thinning the wafer level MEMS package to expose conductive features in the device wafer; forming a first redistribution layer (RDL) at a surface of the thinned wafer level MEMS package, the first RDL electrically coupled to the exposed conductive features; and singulating the wafer level MEMS package to form a plurality of chip scale MEMS packages. - View Dependent Claims (13, 14, 15, 16)
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17. A microelectromechanical systems (MEMS) package, comprising:
a first device substrate comprising one or more first devices formed therein; a MEMS structure having a capping structure thereon disposed at a first major surface of the first device substrate; and a second device substrate comprising one or more second devices formed therein, the second device substrate disposed at a second major surface of the first device substrate, the second major surface opposite the first major surface. - View Dependent Claims (18, 19, 20)
Specification