INTEGRATED PACKAGING OF MULTIPLE DOUBLE SIDED COOLING PLANAR BOND POWER MODULES

• US 20160351468A1
• Filed: 05/20/2016
• Published: 12/01/2016
• Est. Priority Date: 05/28/2015
• Status: Active Grant

• Current Assignee: UT-Battelle LLC
• Original Assignee: UT-Battelle LLC
• Inventors: Liang, Zhenxian
• Granted Patent: US 9,941,234 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04026 Bonding areas specifically adapted for layer connectors
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32 of an individual layer connector
• CPC Class Codes: H01L 2224/32227 the layer connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/83424 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/83447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/83825 Solid-liquid interdiffusion
• CPC Class Codes: H01L 2224/8383 Solid-solid interdiffusion
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 : by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/5385 : Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10272 : Silicon Carbide [SiC]
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.

Claims

1. ) An integrated double sided cooled power module comprising:

one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded together and sandwiched between two heat exchangers;

a segmented coolant manifold interposed with the one or more planar power packages to create a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet.

2. ) The cooled power module of claim 1 wherein each power switch unit includes a SiC metal-oxide-semiconductor field-effect transistor (MOSFET) and a SiC Schottky barrier diode (SBD).

3. ) The cooled power module of claim 2 wherein each power switch unit includes two SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) arranged in parallel and two SiC Schottky barrier diodes (SBDs) arranged in parallel.

4. ) The cooled power module of claim 1 wherein the heat exchangers are pin fin heat exchangers that are directly bonded to each planar power package from dual sides.

5. ) The cooled power module of claim 1 wherein the segmented coolant manifold includes two end segments.

6. ) The cooled power module of claim 5 wherein the segmented coolant manifold includes two or more central segments.

7. ) The cooled power module of claim 6 wherein the two end segments each include one internal coolant channel.

8. ) The cooled power module of claim 7 wherein the central segments each include two internal coolant channels.

9. ) The cooled power module of claim 8 wherein the coolant flow path direction is controlled by segmented coolant manifold.

10. ) The cooled power module of claim 1 wherein the current density (Jd) is about 240 Amperes per Centimeter (A/cm²) when a junction temperature is about 120 degrees Celsius (°

C.).

11. ) The cooled power module of claim 1 and further comprising a coolant disposed in the coolant flow path and wherein the coolant is selected from the group consisting of water, water/glycol mix, oil, and air.

12. ) The cooled power module of claim 1 wherein the direct bonds are formed by soldering, sintering, solid diffusion bonding or liquid diffusion bonding.

13. ) The cooled power module of claim 1 wherein the upper power switch unit and a lower power switch unit are arranged in a face-up and face-down configuration and sandwiched between two patterned DBC substrates.

14. ) The cooled power module of claim 1 and further comprising a sealant material bonded between said planar power packages and said segmented coolant manifold.

15. ) A method of cooling a power module comprising the steps of:

a) providing one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded together and sandwiched between two heat exchangers;

b) interposing a segmented coolant manifold with the one or more planar power packages to create a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet; and

c) circulating a coolant about the coolant flow path.

16. ) The method of claim 15 wherein the providing step includes two heat exchangers having pin fins extending outward from the planar power packages and into the coolant flow path.

17. ) The method of claim 15 wherein the circulating step includes a coolant flow path that traverses through a coolant channel defined by one or more segments of the segmented coolant manifold.

18. ) The method of claim 15 wherein the circulating step circulates a coolant selected from the group consisting of water, water/glycol mix, oil, and air.