LIGHT EMITTING DIODE DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

• US 20160351548A1
• Filed: 05/28/2015
• Published: 12/01/2016
• Est. Priority Date: 05/28/2015
• Status: Abandoned Application

• Current Assignee: Mikro Mesa Technology Co., Ltd.
• Original Assignee: Mikro Mesa Technology Co., Ltd.
• Inventors: CHEN, Li-Yi, CHAN, Chih-Hui, CHANG, Chun-Yi, CHANG, Pei-Yu
• Application Number:
  US14/723,475
• Publication Number:
  US 20160351548A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A manufacturing method of a light emitting diode (LED) display device includes forming at least one sub-pixel circuit on a substrate, forming a primary electrical pad and a first backup electrical pad electrically connected to the sub-pixel circuit, disposing a first micro light emitting device on the primary electrical pad and testing the first micro light emitting device.

Claims

1-18. -18. (canceled)

19. An LED display device, comprising:

a substrate comprising at least one sub-pixel;

at least one sub-pixel circuit disposed on the substrate;

a plurality of electrical pads disposed inside the sub-pixel and electrically connected with the sub-pixel circuit; and

a micro light emitting device disposed on one of the electrical pads.

20. The LED display device of claim 19, further comprising:

a defective micro light emitting device disposed on another one of the electrical pads, wherein the sub-pixel circuit is unconnected with said another one of the electrical pads.

21. The LED display device of claim 20, further comprising:

a passivation layer covers the micro light emitting device and the defective micro light emitting device, wherein the passivation layer has at least one opening to expose a portion of the micro light emitting device; and

at least one opposite electrode electrically connected to the exposed portion of the micro light emitting device.

22. The LED display device of claim 21, wherein the at least one opening exposes a portion of the defective micro light emitting device, and the LED display device further comprises an insulating layer to cover the exposed portion of the defective micro light emitting device.

23. The LED display device of claim 20, wherein the micro light emitting device and the defective micro light emitting device are a micro LED.

24. The LED display device of claim 19, wherein the plurality of the electrical pads have substantially the same shape.

25. The LED display device of claim 19, wherein the plurality of the electrical pads have variety of shapes.