COOLING DEVICE AND ENDOSCOPE LIGHT SOURCE APPARATUS

• US 20160353984A1
• Filed: 08/16/2016
• Published: 12/08/2016
• Est. Priority Date: 05/21/2014
• Status: Active Grant

• Current Assignee: Olympus Corporation
• Original Assignee: Olympus Corporation
• Inventors: SHIROTA, Yutaka, MASAKI, Takahiro
• Granted Patent: US 10,092,174 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: A61B 1/0669 at proximal end of an endoscope
• CPC Class Codes: A61B 1/0684 using light emitting diodes [LED]
• CPC Class Codes: A61B 1/128 provided with means for regulating temperature
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/60 characterised by the use of a forced flow of gas, e.g. air
• CPC Class Codes: F21V 29/673 the fans being used for intake
• CPC Class Codes: F28D 1/024 with an air driving element
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: G02B 23/24 Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
• CPC Class Codes: G02B 23/2476 Non-optical details, e.g. housings, mountings, supports
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating

Abstract

A cooling device according to the invention includes: a first flow channel configured so that a coolant passes; a first heat receiving portion; a first heat radiating portion arranged in the first flow channel; a first heat transferring portion configured to transfer heat from the first heat receiving portion to the first heat radiating portion; a second flow channel configured so that the coolant passes; a second heat receiving portion; a second heat radiating portion arranged in the second flow channel; and a second heat transferring portion configured having a longer length than the first heat transferring portion and transferring heat from the second heat receiving portion to the second heat radiating portion. The second heat radiating portion is configured having a larger surface area than the first heat radiating portion.

Claims

1. A cooling device comprising:

a first flow channel configured so that a coolant passes;

a first heat receiving portion configured so that heat generated by a first heat generating portion, between the heat generated by the first heat generating portion and heat generated by a second generating portion, is transferred, the first and second heat generating portions being arranged along one side surface of the first flow channel outside the first flow channel;

a first heat radiating portion arranged in the first flow channel;

a first heat transferring portion configured to connect the first heat receiving portion and the first heat radiating portion and transfer heat from the first heat receiving portion to the first heat radiating portion;

a second flow channel configured so that the coolant passes, the second flow channel being provided with the first flow channel sandwiched between the one side surface and the second flow channel;

a second heat receiving portion configured so that the heat generated by the second heat generating portion is transferred;

a second heat radiating portion arranged in the second flow channel; and

a second heat transferring portion configured having a longer length than the first heat transferring portion and configured to connect the second heat receiving portion and the second heat radiating portion and transfer heat from the second heat receiving portion to the second heat radiating portion;

wherein

the second heat radiating portion is configured having a larger surface area than the first heat radiating portion.

2. The cooling device according to claim 1, wherein a plurality of the first heat radiating portions are provided, and the plurality of first heat radiating portions are arranged so that at least parts are overlapped in a direction orthogonal to a flow direction of the coolant.

3. The cooling device according to claim 2, wherein the plurality of first heat radiating portions are arranged so as not to be mutually overlapped when seen from a direction along the flow direction of the coolant.

4. The cooling device according to claim 1, wherein a plurality of the second heat radiating portions are provided, and the plurality of second heat radiating portions are arranged so that at least parts are overlapped in the direction orthogonal to the flow direction of the coolant, in the second flow channel.

5. The cooling device according to claim 4, wherein the plurality of second heat radiating portions are arranged so as not to be mutually overlapped when seen from the direction along the flow direction of the coolant.

6. An endoscope light source apparatus comprising a plurality of solid light emitting devices as the first and second heat generating portions, and the cooling device according to claim 1.