WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
First Claim
Patent Images
1. A semiconductor device, comprising:
- an interposer having a first side and a second side opposite to the first side;
at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps;
at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area;
a molding compound disposed on the first side, the molding compound covering the at least one active chip and the at least one dummy chip; and
a plurality of solder bumps mounted on the second side.
6 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps, at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, a molding compound disposed on the first side. The molding compound covers the at least one active chip and the at least one dummy chip. A plurality of solder bumps is mounted on the second side.
-
Citations
10 Claims
-
1. A semiconductor device, comprising:
-
an interposer having a first side and a second side opposite to the first side; at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps; at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area; a molding compound disposed on the first side, the molding compound covering the at least one active chip and the at least one dummy chip; and a plurality of solder bumps mounted on the second side. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
Specification