PACKAGING METHOD FOR VERY HIGH DENSITY CONVERTERS

• US 20160359426A1
• Filed: 12/11/2014
• Published: 12/08/2016
• Est. Priority Date: 12/11/2013
• Status: Abandoned Application

• Current Assignee: Rompower Energy Systems, Inc.
• Original Assignee: Rompower Energy Systems, Inc.
• Inventors: Velasco, Enrique, Jitaru, Ionel, Poynton, Ian
• Application Number:
  US15/103,617
• Publication Number:
  US 20160359426A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/21 using devices of a triode or transistor type requiring continuous application of a control signal
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0256 Electrical insulation details, e.g. around high voltage areas
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/044 Details of backplane or midplane for mounting orthogonal PCBs
• CPC Class Codes: H05K 2201/047 Box-like arrangements of PCBs
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 9/0071 Active shielding

Abstract

Meeting todays requirement in power supply technology demands significant technological advancement in optimizing circuit topology, components and materials, thermal and packaging designs. These requirements are being pushed mainly by continuously increasing power density and efficiency requirements. Ultimately, these trends will come to a point whereby limitations from the above mentioned technological advancements is dependent on one of the above, which is the packaging design. To realize this dependence, we need to look at the growing power systems for modern equipment out there. Let us enumerate some of the available AC adapters in terms of power densities of a 45 W adapter. Firstly, square type architecture introduced by Apple is about 7 W/in3, considering the packaging has a profile limitation whereby its AC plug is removable thus occupying relatively bigger chunk of the volume. The next one is by Asus of similar profile to Apple incorporating the AC Plug eliminating the socket assembly in the packaging; which packs about 9 W/in3. Lastly, the typical rectangular profile by Eos which is about 7 W/in3. As for this particular embodiment it is about 40% smaller in profile, in contrast to the 45 W Apple packaging, with increase power density of about 12 W/in3. Packaging design method plays a great role in achieving the above requirements for a very high density converters.

Claims

1. A high power density converter (1) comprising of:

an assembly of power board (2) which contains a transformer (11), Secondary MOSFETS (12), output capacitors, and connectors for electrical connection provided thereon to connect the secondary board assembly (4) and the primary board assembly (3),

wherein the power board assembly (2) is fitted with an insulation piece (8) for satisfying the clearance safety requirement for this embodiment,

wherein the primary board assembly (3) contains the bulk capacitor (20), primary MOSFETS, primary control, input bridge rectifier (21), and EMI filter circuitry,

wherein the secondary board assembly (4) contains mainly the secondary controller, output switch, and output electrolytic capacitor (19).

wherein all of the boards above when put together forms “

U”

shape configuration, the power board assembly (2) as the base, while the boards primary (3) and secondary (4) forms the legs.

2. The high power density converter of claim 1, wherein in a strategic arrangement of the boards according to claim 1, the power board (2) is positioned such that it is vertically placed laterally along edges of the converter (1), placing the primary board (3) laying horizontally along the bottom cover (7), while the secondary board (4) is placed opposite to the primary board laying horizontally along the top cover (6, as further illustrated in FIG. 11.

3. The power density converter according to claim 2, which has a slot to increase the creepage and clearance using air as an insulation, which separation is not enough to avoid any potential safety hazard, and wherein a solid insulation material is added to the assembly, which reinforces the air insulation gap created by the slot, which insulation piece (8) with the purpose of meeting the required creepage and clearances dictated for safety requirements for this converter (1).

4. The power density converter according to claim 1, wherein the primary board (3) on one of the components in particular, the input bridge rectifier (21) is fitted with a bridge reflector (10), this will serve as a thermal barrier to any close proximity devices, or diffusing extraneous thermal energy or dissipated heat by the input bridge (21), and wherein this bridge reflector (10) is also used as a support for both primary (3) and secondary (4) board assemblies.

5. The power density converter of claim 4, wherein a profile member is made up of thermoplastic material which when press fitted to the back of the input bridge rectifier (21) will served as a good mechanical support and thermal contact for the rectifier, and wherein this thermoplastic material coated or covered with an adhesive backed aluminum foil is to protect components and parts from radiant heat generated by the input bridge rectifier (21).

6. The power density converter of claim 4, wherein the bridge reflector (10) profile can be made up of PCB incorporating the circuitry for communication between primary (3) and secondary (4) board assemblies, and this includes copper traces to extract heat from the input bridge (21), and serve as a support for both boards above.

7. Components and board assembly for a high density converter that are put together prior to placing it into the bottom cover (7), as shown in FIG. 10 and according to the additional detailed description in FIG. 6, wherein the proximity of the primary board (3) circuitry along the body of the transformer (11) core can be as close as possible to it, and due to the extruded profile presented in the bottom cover (7), where the main purpose of this extrusions—

extruded barrier 1 (14) and extruded barrier 2 (15) is to place a solid insulation in between primary and secondary circuitry components for safety requirements for the converter (1).