SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
First Claim
1. A semiconductor arrangement, comprising:
- a three dimensional (3D) integrated circuit (IC) structure comprising;
a first layer comprising;
a first gate of a first transistor; and
an optical transmitter, wherein a first source/drain region of the first transistor is coupled to a first serializer and a second source/drain region of the first transistor is coupled to the optical transmitter, and wherein the first transistor is configured to selectively couple the optical transmitter to the first serializer.
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Abstract
A semiconductor arrangement and a method of forming the same are described. A semiconductor arrangement includes a first layer including a first optical transceiver and a second layer including a second optical transceiver. A first serializer/deserializer (SerDes) is connected to the first optical transceiver and a second SerDes is connected to the second optical transceiver. The SerDes converts parallel data input into serial data output including a clock signal that the first transceiver transmits to the second transceiver. The semiconductor arrangement has a lower area penalty than traditional intra-layer communication arrangements that do not use optics for alignment, and mitigates alignment issues associated with conventional techniques.
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Citations
20 Claims
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1. A semiconductor arrangement, comprising:
a three dimensional (3D) integrated circuit (IC) structure comprising; a first layer comprising; a first gate of a first transistor; and an optical transmitter, wherein a first source/drain region of the first transistor is coupled to a first serializer and a second source/drain region of the first transistor is coupled to the optical transmitter, and wherein the first transistor is configured to selectively couple the optical transmitter to the first serializer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A semiconductor arrangement, comprising:
a three dimensional (3D) integrated circuit (IC) structure comprising; a first layer comprising; a gate of a transistor; and an optical receiver, wherein a first source/drain region of the transistor is coupled to a deserializer and a second source/drain region of the transistor is coupled to the optical receiver, the transistor configured to selectively couple the optical receiver to the deserializer. - View Dependent Claims (15, 16, 17, 18)
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19. A method of making a semiconductor arrangement, comprising:
forming a three dimensional (3D) integrated circuit (IC) structure comprising; doping a first layer to define a first source/drain region, a second source/drain region, and a doped area; forming a second layer over the first layer; etching the first layer to form a first opening between the first source/drain region and the second source/drain region and a second opening overlying the doped area; forming a gate within the first opening; and forming an optical receiver within the second opening. - View Dependent Claims (20)
Specification