CMOS-MEMS-CMOS PLATFORM
First Claim
1. A sensor chip comprising:
- a first substrate with a first surface and a second surface comprising at least one CMOS circuit;
a MEMS substrate with a first surface and a second surface; and
a second substrate comprising at least one CMOS circuit;
wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate; and
wherein the second surface of the MEMS substrate is attached to the second CMOS substrate; and
wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical interconnects.
1 Assignment
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Accused Products
Abstract
A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.
16 Citations
21 Claims
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1. A sensor chip comprising:
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a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit; wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate; and wherein the second surface of the MEMS substrate is attached to the second CMOS substrate; and wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical interconnects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A sensor chip comprising:
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a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a first MEMS substrate with a first surface and a second surface; a second substrate; a second MEMS substrate; and a third substrate comprising at least one CMOS circuit; wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate; and wherein the second surface of the MEMS substrate is attached to the second CMOS substrate; and wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification