Encapsulating Structure of Display Panel and Method for the Display Panel

• US 20160364054A1
• Filed: 04/19/2016
• Published: 12/15/2016
• Est. Priority Date: 06/10/2015
• Status: Abandoned Application

• Current Assignee: Everdisplay Optonics (Shanghai) Limited
• Original Assignee: Everdisplay Optonics (Shanghai) Limited
• Inventors: Chen, Yujen, Zhang, Mingyue
• Application Number:
  US15/132,979
• Publication Number:
  US 20160364054A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens

Abstract

A encapsulating structure of a display panel includes a substrate, a frit layer disposed around a periphery of the substrate, and a touch cover lens mounted on the substrate. A metal mesh is mounted in the touch cover lens for receiving a touch control signal. A plurality of touch wires is disposed between the frit layer and the substrate and is electrically connected to the metal mesh. A method for encapsulating a display panel includes producing a plurality of touch wires on a substrate and electrically connecting the touch wires to a flexible circuit board on a side of the substrate. A glass frit is applied on the touch wires and covers the touch wires. A touch cover lens is disposed on the substrate and includes a metal mesh. The touch cover lens is bonded to the substrate by the glass frit.

Claims

1. An encapsulating structure of a display panel comprising a substrate, a frit layer disposed around a periphery of the substrate, and a touch cover lens disposed above the substrate, with a metal mesh disposed on the touch cover lens and adapted for receiving a touch signal, with a plurality of touch wires disposed between the frit layer and the substrate, and with the plurality of touch wires electrically connected to the metal mesh.

2. The encapsulating structure of a display panel as claimed in claim 1, wherein the plurality of touch wires are disposed on a bonding face of the substrate and respectively comprises a pad layer disposed on the bonding face of the substrate, and the pad layer comprises a plurality of pads spaced from each other.

3. The encapsulating structure of a display panel as claimed in claim 2, wherein the pad layer is made of silicon oxide or silicon nitride.

4. The encapsulating structure of a display panel as claimed in claim 2, wherein a ratio of a width of each of the plurality of pads to a width of each of the plurality of touch wires is in a range between 2:

5 and 4;

5.

5. The encapsulating structure of a display panel as claimed in claim 2, wherein an area of pad layer is ⅕

to ⅓

of an area of the plurality of touch wires.

6. A method for encapsulating a display panel, comprising:

producing a plurality of touch wires on a substrate and electrically connecting the plurality of touch wires to a flexible circuit board on a side of the substrate;

applying a frit on the plurality of touch wires, with the frit covering the plurality of touch wires; and

disposing a touch cover lens on the substrate, with the touch cover lens including a metal mesh, and with the touch cover lens bonded to the substrate by the frit.

7. The method for encapsulating a display panel as claimed in claim 6, with the plurality of touch wires disposed on a bonding face of the substrate, with the method further comprising disposing a pad layer on the bonding face of the substrate before producing the plurality of touch wires on the substrate, and with the pad layer including a plurality of pads spaced from each other.

8. The method for encapsulating a display panel as claimed in claim 7, wherein the pad layer is made of silicon oxide or silicon nitride.

9. The method for encapsulating a display panel as claimed in claim 7, wherein a ratio of a width of each of the plurality of pads to a width of each of the plurality of touch wires is in a range between 2:

5 and 4;

5.

10. The method for encapsulating a display panel as claimed in claim 7, wherein an area of each of the plurality of pad layers is ⅕

to ⅓

of an area of the plurality of touch wires.