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CHEMOEPITAXY ETCH TRIM USING A SELF ALIGNED HARD MASK FOR METAL LINE TO VIA

  • US 20160365280A1
  • Filed: 06/12/2015
  • Published: 12/15/2016
  • Est. Priority Date: 06/12/2015
  • Status: Active Grant
First Claim
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1. A method of forming electrically conductive structures that are aligned to underlying metal features comprising:

  • forming a neutral layer overlying a dielectric layer;

    patterning the neutral layer and the dielectric layer to provide openings that are filled with a metal material to provide first metal features;

    depositing a self-assembled di-block copolymer material on a patterned surface of the neutral layer and the first metal features, the self-assembled di-block copolymer material includes a first block composition with a first affinity for alignment to the first metal features;

    converting the first block composition of the self-assembled di-block copolymer to second metal features that are self-aligned to the first metal features.

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