SERIES RESISTANCE REDUCTION IN VERTICALLY STACKED SILICON NANOWIRE TRANSISTORS
First Claim
1. A method of fabricating a portion of a nanowire field effect transistor (FET), the method comprising:
- forming a sacrificial layer and a nanowire layer;
removing a sidewall portion of the sacrificial layer;
forming a diffusion block in a space that was occupied by the removed sidewall portion of the sacrificial layer;
forming a source region and a drain region such that the diffusion block is between the sacrificial layer and at least one of the source region and the drain region; and
removing the sacrificial layer using a sacrificial layer removal process, wherein the diffusion block prevents the sacrificial layer removal process from also removing portions of at least one of the source region and the drain region.
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Abstract
Embodiments are directed to a method of fabricating a portion of a nanowire field effect transistor (FET). The method includes forming a sacrificial layer and a nanowire layer, removing a sidewall portion of the sacrificial layer and forming a diffusion block in a space that was occupied by the removed sidewall portion of the sacrificial layer. The method further includes forming a source region and a drain region such that the diffusion block is between the sacrificial layer and at least one of the source region and the drain region, and removing the sacrificial layer using a sacrificial layer removal process, wherein the diffusion block prevents the sacrificial layer removal process from also removing portions of at least one of the source region and the drain region.
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Citations
20 Claims
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1. A method of fabricating a portion of a nanowire field effect transistor (FET), the method comprising:
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forming a sacrificial layer and a nanowire layer; removing a sidewall portion of the sacrificial layer; forming a diffusion block in a space that was occupied by the removed sidewall portion of the sacrificial layer; forming a source region and a drain region such that the diffusion block is between the sacrificial layer and at least one of the source region and the drain region; and removing the sacrificial layer using a sacrificial layer removal process, wherein the diffusion block prevents the sacrificial layer removal process from also removing portions of at least one of the source region and the drain region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A nanowire field effect transistor (FET) comprising:
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a sacrificial layer and a nanowire layer; a diffusion block formed adjacent to the sacrificial layer; and a source region and a drain region positioned such that the diffusion block is between the sacrificial layer and at least one of the source region and the drain region; wherein the diffusion block prevents a sacrificial layer removal process performed during fabrication of the nanowire FET from also removing portions of at least one of the source region and the drain region. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification