ORGANIC ELECTRONIC DEVICES

• US 20160365526A1
• Filed: 11/25/2014
• Published: 12/15/2016
• Est. Priority Date: 11/26/2013
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Original Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Inventors: Manceau, Matthieu, Berson, Solenn
• Granted Patent: US 9,882,155 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/331 Nanoparticles used in non-emissive layers, e.g. in packaging layer
• CPC Class Codes: H10K 30/353 comprising blocking layers, e.g. exciton blocking layers
• CPC Class Codes: H10K 30/40 comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
• CPC Class Codes: H10K 30/81 Electrodes
• CPC Class Codes: H10K 30/88 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/11 characterised by the electroluminescent [EL] layers
• CPC Class Codes: H10K 50/157 between the light-emitting layer and the cathode
• CPC Class Codes: H10K 50/805 Electrodes
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

An organic electronic device having an architecture with an inverted structure, containing a substrate, a first electrode deposited on the substrate, a second electrode and at least one assembly including a multilayer stack disposed between the electrodes, the multilayer stack including the following, successively from the first electrode: an N-type layer; an electrically active layer; and a P-type layer comprising a mixture of poly(3,4-ethylenedioxythiophene):poly (styrene-sulfonate), the stack containing an additional layer, known as the adhesion layer, formed by at least one metallic oxide and inserted between, and in contact with, the active layer and the P-layer. Also, a method for producing such a device.

Claims

1-14. -14. (canceled)

15. An organic electronic device having an inverted structure architecture, containing a substrate, a first electrode deposited on the substrate, a second electrode and at least one assembly comprising a multilayer stack placed between said electrodes, said multilayer stack comprising in succession from the first electrode:

an n-type layer;

an electrically active layer; and

a p-type layer based on a poly(3,4-ethylenedioxythiophene);

polystyrene sulfonate mixture;

wherein said stack contains an additional layer that is what is referred to as a “

tie layer”

composed of at least one metal oxide and that is intermediate between and in contact with the active layer and the p-type layer.

16. The device as claimed in claim 15, wherein the tie layer is a layer of metal oxide(s) in nanoparticle form.

17. The device as claimed in claim 15, wherein the tie layer is a layer comprising at least one metal oxide chosen from the following metal oxides:

V₂O₅, NiO, MoO₃, WO₃ and mixtures thereof and possesses a thickness ranging from 2 nm to 200 nm.

18. The device as claimed in claim 15, wherein the tie layer comprises at least one metal oxide chosen from the following metal oxides:

T_iO_x in which x is lower than or equal to 2, ZnO and mixtures thereof, and has a thickness ranging from 2 nm to 10 nm.

19. The device as claimed in claim 15, wherein the tie layer comprises at least one metal oxide chosen from the following metal oxides:

Al₂O₃, SiO₂ and mixtures thereof and has a thickness ranging from 2 nm to 10 nm.

20. The organic electronic device as claimed in claim 15, wherein the active layer is an n-type semiconductor blended with a p-type semiconductor.

21. The organic electronic device as claimed in claim 20, wherein the p-type semiconductor is chosen from polymers containing thiophene units, polymers containing thienothiophene units, polymers containing diketopyrrolopyrrole units, polymers containing benzothiadiazole units, polymers containing thienopyrroledione units, polymers containing bithiophene dicarboximide units and polymers containing carbazole units, and p-type semiconductor molecules chosen from porphyrin, 7,7′

-(4,4-bis(2-ethylhexyl)-4H-silolo[3,2-b;

4,5-b 2]dithiophene-2,6-diyl)bis(6-fluoro-4-(5′

-hexyl-[2,2′

-bithiophene]-5-yl)benzo[c][1,2,5]thiadiazoles), boron-dipyrromethenes and molecules with triphenylamine as a core.

22. The organic electronic device as claimed in claim 20, wherein the n-type semiconductor is chosen from materials containing fullerene units, and materials containing perylene units.

23. The organic electronic device as claimed in claim 22, wherein the n type semiconductor is chosen from materials containing C₆₀, C₇₀, C₈₀ and C₈₄ fullerene units.

24. The organic electronic device as claimed in claim 22, wherein the n-type semiconductor is chosen from PC₆₀BM and PC₇₀BM.

25. The organic electronic device as claimed in claim 15, wherein the n-type layer comprises at least one metal oxide chosen from the following metal oxides:

TiO_x in which x is lower than or equal to 2, ZnO and mixtures thereof and has a thickness comprised between 2 nm and 200 nm.

26. The organic electronic device as claimed in claim 15, comprising first and second electrodes and an assembly comprising a multilayer stack containing a tie layer, said assembly being placed between said electrodes.

27. The organic electronic device as claimed in claim 15, comprising first and second electrodes and two assemblies each comprising a multilayer stack containing a tie layer, said assemblies being placed between said electrodes.

28. A process for preparing a multilayer stack, having an inverted structure architecture, comprising an electrically active layer superposed on an n-type layer, wherein said process comprises forming a layer that is what is referred to as a “

tie layer”

intermediate between and in contact with the layer referred to as the active layer and the p-layer, said “

tie layer”

being formed from at least one metal oxide.

29. The process as claimed in claim 28, said “

tie layer”

being formed from at least a metal oxide in nanoparticle state.

30. A process for preparing an organic electronic device of inverted structure comprising at least the following steps:

(i) providing a substrate coated on one of its sides with a multilayer stack comprising in order of superposition from said substrate;

a conductive layer by way of first electrode and an n-type layer;

(ii) forming an electrically active layer on the n-type layer;

(iii) bringing said active layer into contact with a medium containing particles, of at least one metal oxide, and exposing the assembly to conditions propitious to the formation of what is referred to as a tie layer;

(iv) forming, by wet processing, in contact with the tie layer, a p-type layer based on a blend of two polymers;

poly(3,4-ethylenedioxythiophene) (PEDOT) and sodium polystyrene sulfonate (PSS), i.e. the polymer blend referred to as PEDOT;

PSS; and

(v) depositing in contact with the p-type layer a conductive layer by way of second electrode.

31. The process as claimed in claim 30, wherein the particles in the medium in step (iii) are nanoparticles.

32. A process for improving the adhesion between an electrically active layer and a p-type layer in an organic electronic device, said process consisting in forming a layer composed of at least one metal oxide at the intersection of the two layers.