MODULAR FLEXIBLE SENSOR ARRAY

• US 20160370210A1
• Filed: 06/18/2015
• Published: 12/22/2016
• Est. Priority Date: 06/18/2015
• Status: Abandoned Application

• Current Assignee: Amphenol Thermometrics, Inc. (Amphenol Corporation)
• Original Assignee: Amphenol Thermometrics, Inc. (Amphenol Corporation)
• Inventors: Kapusta, Christopher James, Knobloch, Aaron Jay, Karp, Jason
• Application Number:
  US14/743,263
• Publication Number:
  US 20160370210A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: G01L 1/205 using distributed sensing elements

Abstract

The invention is directed to modular flexible sensor arrays that are adaptable, easy to manufacture, and which reduce material waste. A method of making a modular flexible sensor array is provided, including the steps of applying at least one sensing element to a first substrate to form at least one sensor, applying at least one electrically conductive interconnect to a surface of a second flexible substrate, and coupling the at least one sensor to the at least one electrically conductive interconnect such that the at least one sensor is electrically connected thereto.

Claims

1. A method of making a modular flexible sensor array comprising the steps of:

applying at least one sensing element to a first substrate to form at least one sensor;

applying at least one electrically conductive interconnect to a surface of a second flexible substrate discrete from the first substrate; and

attaching the at least one sensor to the at least one electrically conductive interconnect such that the sensor is electrically connected thereto.

2. The method according to claim 1, wherein a plurality of sensing elements are formed on the first substrate, and the first substrate is then divided to separate each of the plurality of sensing elements to form a plurality of discrete sensors.

3. The method according to claim 1, wherein the at least one sensing element is formed of platinum.

4. The method according to claim 1, wherein the at least one sensor is at least one of a temperature sensor, strain gage sensor, eddy current sensor, gas sensor, or pressure sensor.

5. The method according to claim 1, wherein the first substrate and/or the second flexible substrate is formed of polyimide film, polyester film, polyethylene terephthalate film, or liquid crystal polymer.

6. The method according to claim 1, wherein the at least one electrically conductive interconnect is formed of aluminum or copper.

7. The method according to claim 1, wherein the at least one sensor is coupled to the at least one electrically conductive interconnect by solder, conductive epoxy, tape automated bonding (TAB), anisotropic conductive film (ACF) bonding, or anistropic conductive paste (ACP) bonding.

8. The method according to claim 1, wherein the at least one sensor and the at least one electrically conductive interconnect each have at least one connection pad.

9. The method according to claim 8, wherein the connection pad of the electrically conductive interconnect is directly engaged with the connection pad of the sensor.

10. The method according to claim 8, wherein the sensor is coupled to the connection pad of the electrically conductive interconnect by a through-via that extends from the sensing element of the sensor through the first substrate to the connection pad of the electrically conductive interconnect.

11. The method according to claim 10, wherein the at least one connection pad of the at least one sensor or the at least one electrically conductive interconnect is formed of copper/nickel/gold alloy.

12. The method according to claim 1, wherein the first substrate has a thickness of about 100 microns or less, preferably about 25 microns or less.

13. The method according to claim 1, wherein the at least one sensing element has a thickness of about 100 microns or less, preferably about 25 microns or less.

14. The method according to claim 1, wherein the step of applying at least one sensing element to a first substrate is done by sputtering, evaporation or electroplating.

15. The method according to claim 1, wherein the at least one electrically conductive interconnect has an alignment mechanism that engages with an alignment mechanism on the at least one sensor.

16. The method according to claim 1, the modular flexible sensor array includes electrically erasable programmable read-only memory, at least one thermistor, at least one integrated circuit, at least one wireless antenna, or a combination thereof.

17. The method according to claim 1, further comprising the step of applying a uniform coverlay over a surface of the sensor array after the at least one sensor is attached to the at least one electrically conductive interconnect.

18. The method according to claim 1, further comprising the steps of:

applying a first coverlay over a surface of the at least one electrically conductive interconnect; and

applying a second coverlay over a surface of the at least one sensor.

19. The method according to claim 18, wherein the steps of applying a first coverlay and a second coverlay may be done by dip coating or spray coating.

20. The method according to claim 1, wherein the at least one sensing element is formed by a first process and the at least one electrically conductive interconnect is formed by a second process discrete from the first process.

21. A modular flexible sensor array comprising:

a flexible substrate having at least one surface;

a plurality of electrically conductive interconnects on the surface of the flexible substrate, each of the plurality of electrically conductive interconnects having at least one connection pad; and

at least one discrete sensor attached to the at least one connection pad of the plurality of electrically conductive interconnects.

22. The modular flexible sensor array of claim 21, wherein the at least one discrete sensor comprises a substrate and a sensing element.

23. The modular flexible sensor array of claim 22, wherein the sensing element is provided on a bottom side of the substrate and wherein the sensing element faces and is directly attached to the at least one connection pad of the electrically conductive interconnects.

24. The modular flexible sensor array of claim 22, wherein the sensing element is provided on a top side of the substrate and a bottom side of the substrate makes contact with the at least one connection pad of the electrically conductive interconnects, such that the sensing element is directly connected to the at least one connection pad of the electrically conductive interconnects by a through via that extends from the top side of the substrate to the bottom side of the substrate.

25. The modular flexible sensor array of claim 21, comprising a plurality of discrete sensors, wherein the sensors are temperature, strain gage, eddy current, gas, RTD, or pressure sensors, or combinations thereof.

26. The modular flexible sensor array of claim 21, wherein the modular flexible sensor array may be physically deformed and then return to its original shape when in use.

27. The modular flexible sensor array of claim 21, wherein the modular flexible sensor array may be physically deformed to conform to the shape of a device being measured.