PRE-LAYER DEFECT SITE REVIEW USING DESIGN
First Claim
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1. A system comprising:
- a defect review tool, wherein the defect review tool includes;
a stage configured to clamp a wafer; and
an image generation system configured to generate an image of a layer of a surface of the wafer; and
a controller configured to communicate with the defect review tool, wherein the controller is configured to;
align a design file for a current layer of the wafer to an image of the current layer;
align a design file for a previous layer of the wafer to the design file for the current layer, wherein the previous layer is formed prior to the current layer; and
identify a region of the image of the current layer based on a coordinate of a defect in the previous layer, wherein the region corresponds to the coordinate of the defect in the previous layer.
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Abstract
A system and method to image a layer of a wafer based on a coordinate of a defect in a pre-layer of the wafer are disclosed. A design file for the current layer can be aligned to the wafer using an image of the current layer. A design file for a previous layer can be aligned to the design file for the current layer.
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Citations
18 Claims
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1. A system comprising:
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a defect review tool, wherein the defect review tool includes; a stage configured to clamp a wafer; and an image generation system configured to generate an image of a layer of a surface of the wafer; and a controller configured to communicate with the defect review tool, wherein the controller is configured to; align a design file for a current layer of the wafer to an image of the current layer; align a design file for a previous layer of the wafer to the design file for the current layer, wherein the previous layer is formed prior to the current layer; and identify a region of the image of the current layer based on a coordinate of a defect in the previous layer, wherein the region corresponds to the coordinate of the defect in the previous layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method comprising:
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aligning a wafer in a defect review tool using a stage; marking at least one die corner of the wafer; aligning using a controller a design file for a current layer of the wafer to an image of the current layer; aligning using the controller a design file for a previous layer of the wafer to the design file for the current layer, wherein the previous layer is formed prior to the current layer; and identifying a region of the image of the current layer based on a coordinate of a defect in the previous layer using the controller, wherein the region corresponds to the coordinate of the defect in the previous layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification