INTEGRATED PASSIVE COMPONENTS IN A STACKED INTEGRATED CIRCUIT PACKAGE
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Abstract
Integrated passive components in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power, a second die having a processing core and coupled to the first die over the first die, the first die being coupled to the power supply circuit to power the processing core, and a passive device attached to the first die and coupled to the power supply circuit.
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Citations
40 Claims
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1-20. -20. (canceled)
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21. An apparatus comprising:
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a substrate; a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power; a second die having a processing core and coupled to the first die over the first die, the second die being coupled to the power supply circuit to power the processing core; and a passive device attached to the first die and coupled to the power supply circuit. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A stacked die package comprising:
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a cores die having a plurality of processing cores; an uncore die having a power supply circuit for each processing core, each power supply circuit being independently coupled to each respective processing core to supply power to the respective processing core; a package substrate coupled to the uncore die to receive power from an external source and to provide power to the power supply circuits of the uncore die; a plurality of through silicon vias through the uncore die to carry data signals from the cores die to the package substrate; and a plurality of passive devices attached to the uncore die between the uncore die and the cores die each coupled to a power supply circuit.
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37. The stacked die package wherein the =core die has a front side facing the cores die and wherein the plurality of passive devices are capacitors attached to the front side of the uncore die.
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38. A computing device comprising:
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a system board; a communication package connected to the system board; and a processor package having a substrate, an uncore die coupled to the substrate over the substrate, the uncore die including a power supply circuit coupled to the substrate to receive power, a cores die having a processing core and coupled to the uncore die over the uncore die, the uncore die being coupled to the power supply circuit to power the processing core, and a passive device attached to the uncore die and coupled to the power supply circuit. - View Dependent Claims (39, 40)
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Specification