ELECTRICAL ELEMENT, MOBILE DEVICE, AND METHOD FOR MANUFACTURING ELECTRICAL ELEMENT

• US 20160372819A1
• Filed: 09/06/2016
• Published: 12/22/2016
• Est. Priority Date: 03/27/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: MORITA, Isamu, ARAKI, Keisuke, OKAMOTO, Bunta, ISHINO, Satoshi, SASAKI, Jun, OTSUBO, Yoshihito, SAKAI, Norio
• Granted Patent: US 10,476,133 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate

Abstract

An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

Claims

1. An electrical element comprising:

a flexible substrate; and

a rigid member greater than the flexible substrate in thickness and in rigidity;

wherein

at least one of the flexible substrate and the rigid member is made of thermoplastic resin;

a conductor pattern that defines at least a portion of a section that performs a main function of the electrical element is provided at the flexible substrate;

no conductor pattern that defines the section that performs the main function of the electrical element is provided at the rigid member; and

opposing surface of the flexible substrate and the rigid member are directly joined to each other.

2. The electrical element according to claim 1, wherein the rigid member is a spacer that maintains an interval between the flexible substrate and another member near the electrical element.

3. The electrical element according to claim 1, wherein the conductor pattern provided at the flexible substrate defines at least a portion of a high-frequency circuit that performs the main function.

4. The electrical element according to claim 3, wherein the high-frequency circuit is an antenna circuit.

5. The electrical element according to claim 4, wherein the rigid member includes a first surface joined to the flexible substrate and a second surface opposite to the first surface;

a ground conductor is disposed on substantially an entirety of the second surface of the rigid member; and

a lead-out wiring extends from the ground conductor to the first surface of the rigid member and connects to the antenna circuit.

6. The electrical element according to claim 1, wherein no conductor pattern is provided at the rigid member.

7. The electrical element according to claim 1, wherein the flexible substrate and the rigid member are respectively made of thermoplastic resins that are identical or substantially identical to each other in a main component.

8. A mobile device comprising the electrical element according to claim 1, wherein the electrical element is in contact with a member inside the mobile device via the rigid member.

9. The mobile device according to claim 8, wherein the rigid member is a spacer that maintains an interval between the flexible substrate and another member near the electrical element.

10. The mobile device according to claim 8, wherein the conductor pattern provided at the flexible substrate defines at least a portion of a high-frequency circuit that performs the main function.

11. The mobile device according to claim 10, wherein the high-frequency circuit is an antenna circuit.

12. The mobile device according to claim 11, wherein

the rigid member includes a first surface joined to the flexible substrate and a second surface opposite to the first surface;

a ground conductor is disposed on substantially an entirety of the second surface of the rigid member; and

a lead-out wiring extends from the ground conductor to the first surface of the rigid member and connects to the antenna circuit.

13. The mobile device according to claim 8, wherein no conductor pattern is provided at the rigid member.

14. The mobile device according to claim 8, wherein the flexible substrate and the rigid member are respectively made of thermoplastic resins that are identical or substantially identical to each other in a main component.

15. A method for manufacturing an electrical element, the electrical element including a flexible substrate and a rigid member greater than the flexible substrate in thickness and in rigidity, the rigid member being provided with no conductor pattern that defines a section that performs a main function of the electrical element, the method comprising:

bringing the rigid member into contact with a portion of a main surface of the flexible substrate; and

directly joining respective opposing surfaces of the flexible substrate and the rigid member to each other by locally heating portions of the flexible substrate and the rigid member where the flexible substrate and the rigid member are in contact with each other and melting thermoplastic resin that defines at least one of the flexible substrate and the rigid member.

16. The method according to claim 15, wherein, in the joining, respective portions of the flexible substrate and the rigid member where the flexible substrate and the rigid member are in contact with each other are locally heated by application of ultrasonic vibrations.

17. The method according to claim 15, wherein the rigid member is a spacer that maintains an interval between the flexible substrate and another member near the electrical element.

18. The method according to claim 15, wherein the conductor pattern provided at the flexible substrate defines at least a portion of a high-frequency circuit that performs the main function.

19. The method according to claim 18, wherein the high-frequency circuit is an antenna circuit.

20. The method according to claim 19, wherein

the rigid member includes a first surface joined to the flexible substrate and a second surface opposite to the first surface;

a ground conductor is disposed on substantially an entirety of the second surface of the rigid member; and

a lead-out wiring extends from the ground conductor to the first surface of the rigid member and connects to the antenna circuit.