IMAGE PROCESSING PACKAGE AND CAMERA MODULE HAVING SAME

• US 20160373629A1
• Filed: 11/27/2014
• Published: 12/22/2016
• Est. Priority Date: 12/02/2013
• Status: Active Grant

• Current Assignee: SK Hynix Inc.
• Original Assignee: Siliconfile Technologies Incorporated (SK Hynix Inc.)
• Inventors: JUNG, Huy Chan, AHN, Heui-Gyun, AHN, Sang Wook, LEE, Yong Woon
• Granted Patent: US 10,165,169 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H04N 23/45 for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.

Claims

1. An image processing package, comprising:

an image sensor suitable for receiving an image of a subject, which is incident from an outside, in a form of light and converting the image of the subject into an image signal; and

an image signal processor suitable for processing the image signal which is outputted from the image sensor and reproducing the image of the subject,

wherein the image sensor is vertically stacked on the image signal processor.

2. The image processing package of claim 1, wherein the image sensor and the image signal processor are electrically coupled to each other by one of a through silicon via (TSV) manner and a direct bonding interface (DBI) manner.

3. The image processing package of claim 1, further comprising:

a controller suitable for controlling an operation of the image signal processor,

wherein the controller is disposed on a lower portion of the image signal processor.

4. The image processing package of claim 3, wherein the image signal processor and the controller are electrically coupled to each other by one of a through silicon via (TSV) manner and a direct bonding interface (DBI) manner.

5. The image processing package of claim 3, further comprising:

a memory device suitable for storing a signal outputted from the controller,

wherein the memory device is disposed on a lower portion of the controller.

6. The image processing package of claim 5, wherein the controller and the memory device are electrically coupled to each other by one of a through silicon via (TSV) manner and a direct bonding interface (DBI) manner.

7. The image processing package of claim 1, wherein the image sensor and the image signal processor are stacked on a package substrate, which is electrically coupled to an external device.

8. The image processing package of claim 7, wherein the image sensor and the image signal processor are encapsulated by an encapsulant, and an upper portion of the image sensor is opened such that a light is incident from an outside.

9. A camera module, comprising:

a body,

an optical series mounted on an upper portion of the body and having at least one lens;

a color filter suitable disposed on a lower portion of the optical series and filtering and outputting a light, which passes through the optical series; and

an image processing package disposed on a lower portion of the color filter, receiving the light outputted from the color filter and performing an image process.

10. The camera module of claim 9, wherein the image processing package includes:

an image sensor suitable for receiving an image of a subject, which is incident from an outside, in a form of light and converting the image of the subject into an image signal; and

an image signal processor suitable for processing the image signal which is outputted from the image sensor and reproducing the image of the subject,

wherein the image sensor is vertically stacked on the image signal processor.

11. The camera module of claim 10, wherein the image sensor and the image signal processor are electrically coupled to each other by one of a through silicon via (TSV) manner and a direct bonding interface (DBI) manner.

12. The camera module of claim 10, further comprising:

a controller suitable for controlling an operation of the image signal processor,

wherein the controller is disposed on a lower portion of the image signal processor.

13. The camera module of claim 12, wherein the image signal processor and the controller are electrically coupled to each other by one of a through silicon via (TSV) manner and a direct bonding interface (DBI) manner.

14. The camera module of claim 12, further comprising:

a memory device suitable for storing a signal outputted from the controller,

wherein the memory device is disposed on a lower portion of the controller.

15. The camera module of claim 14, wherein the controller and the memory device are electrically coupled to each other by one of a through silicon via (TSV) manner and a direct bonding interface (DBI) manner.

16. The camera module of claim 10, wherein the image sensor and the image signal processor are stacked on a package substrate, which is electrically coupled to an external device.

17. The camera module of claim 16, wherein the image sensor and the image signal processor are encapsulated by an encapsulant, and an upper portion of the image sensor is opened such that a light is incident from an outside.