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System and Method for Adhering a Semiconductive Wafer to a Mobile Electrostatic Carrier through a Vacuum

  • US 20160379862A1
  • Filed: 09/08/2016
  • Published: 12/29/2016
  • Est. Priority Date: 11/11/2013
  • Status: Active Grant
First Claim
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1. A system for adhering a semiconductive wafer to a mobile electrostatic carrier (MESC) through a vacuum comprises:

  • an MESC;

    a layer of patterned material;

    said layer of patterned material comprises an exposed surface, an unexposed surface, and a plurality of cavities;

    said layer of patterned material being superimposed onto a bonding surface of said MESC;

    said plurality of cavities being distributed across said layer of patterned material; and

    each of said plurality of cavities traversing into said layer of patterned material from said exposed surface towards said unexposed surface.

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