System and Method for Adhering a Semiconductive Wafer to a Mobile Electrostatic Carrier through a Vacuum
First Claim
1. A system for adhering a semiconductive wafer to a mobile electrostatic carrier (MESC) through a vacuum comprises:
- an MESC;
a layer of patterned material;
said layer of patterned material comprises an exposed surface, an unexposed surface, and a plurality of cavities;
said layer of patterned material being superimposed onto a bonding surface of said MESC;
said plurality of cavities being distributed across said layer of patterned material; and
each of said plurality of cavities traversing into said layer of patterned material from said exposed surface towards said unexposed surface.
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Accused Products
Abstract
A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive wafer. A layer of patterned material is superimposed across the bonding surface of MESC so that the cavities integrated into the layer of patterned material are able produce micro-vacuums that further adhere the semiconductive wafer to the MESC.
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Citations
17 Claims
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1. A system for adhering a semiconductive wafer to a mobile electrostatic carrier (MESC) through a vacuum comprises:
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an MESC; a layer of patterned material; said layer of patterned material comprises an exposed surface, an unexposed surface, and a plurality of cavities; said layer of patterned material being superimposed onto a bonding surface of said MESC; said plurality of cavities being distributed across said layer of patterned material; and each of said plurality of cavities traversing into said layer of patterned material from said exposed surface towards said unexposed surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification