ADHESIVE JOINT SYSTEM FOR PRINTED CIRCUIT BOARDS
First Claim
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1. An adhesive joint system, comprising:
- a circuit board including a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing, the tongue and groove connection including a tongue and a groove and a gap between the tongue and the groove;
an adhesive positioned at least in the gap surrounding the tongue; and
an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side;
wherein respective coefficients of thermal expansion of the tongue, adhesive, and material defining the groove are related such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
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Abstract
An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
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Citations
20 Claims
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1. An adhesive joint system, comprising:
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a circuit board including a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing, the tongue and groove connection including a tongue and a groove and a gap between the tongue and the groove; an adhesive positioned at least in the gap surrounding the tongue; and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side; wherein respective coefficients of thermal expansion of the tongue, adhesive, and material defining the groove are related such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for assembling an electronic device comprising an adhesive joint system, the method comprising:
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forming a tongue; forming a groove in a material defining the groove; mounting a circuit board onto a housing, such that the tongue is disposed within the groove and an adhesive is disposed in a gap between the tongue and groove, thereby forming a tongue and groove connection on a proximal end on a first side of the circuit board; and mounting at least an electronic component on a distal end on a second side of the circuit board that is opposite the first side; wherein respective coefficients of thermal expansion of the tongue, adhesive, and material defining the groove are related such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A head mounted computing device, comprising:
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a housing; an image production system coupled to the housing; a position sensing system coupled to the housing; a see-through holographic display coupled to the housing and configured to display holographic images output from the image production system at locations on the see-though holographic display which are calculated based on a position sensed by the position sensing system; and wherein the position sensing system includes a circuit board; and wherein the circuit board includes a distal end and a proximal end mounted on a first side via a tongue and groove connection to the housing, the tongue and groove connection including a tongue and a groove and a gap between the tongue and the groove; wherein an adhesive is positioned at least in the gap surrounding the tongue; and wherein an inertial motion sensor is mounted to the distal end on a second side of the circuit board that is opposite the first side; and wherein respective coefficients of thermal expansion of the tongue, adhesive, and material defining the groove are related such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
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Specification