PEDESTAL MOUNTING OF SENSOR SYSTEM

• US 20160381798A1
• Filed: 06/29/2015
• Published: 12/29/2016
• Est. Priority Date: 06/29/2015
• Status: Active Grant

• Current Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Original Assignee: Microsoft Technology Licensing LLC (Microsoft Corporation)
• Inventors: Wu, Yinan, Sutton, Michael S.
• Granted Patent: US 10,869,393 B2
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01C 21/10 by using measurements of speed or acceleration G01C21/24, G01C21/26 take precedence
• CPC Class Codes: G01C 25/00 Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass testing, calibrating or compensating compasses G01C17/38
• CPC Class Codes: G01D 11/30 Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence

Abstract

Examples related to the incorporation of a sensor into an electronic device are disclosed. One example provides a system including a circuit board comprising a first side and a second side opposite the first side, a sensor housed in a package bonded to the first side of the circuit board, and a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device.

Claims

1. A system comprising:

a circuit board comprising a first side and a second side opposite the first side;

a sensor housed in a package bonded to the first side of the circuit board; and

a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device.

2. The system of claim 1, wherein the package is formed from a first material and the mounting pedestal is formed from a second material, the first and second materials each having a coefficient of thermal expansion value that is within a threshold similarity based upon a sensor error tolerance.

3. The system of claim 1, wherein the package has a first footprint and the mounting pedestal has a second footprint symmetric to the first footprint.

4. The system of claim 1, wherein the mounting pedestal is coupled to the circuit board on the second side at a location directly opposite the package.

5. The system of claim 1, wherein the package is soldered to the circuit board, and wherein the mounting pedestal is soldered to the circuit board.

6. The system of claim 1, wherein the sensor is a first inertial motion sensor, and further comprising a second inertial motion sensor coupled to the circuit board.

7. The system of claim 6, wherein first inertial motion sensor is a gyroscope, and wherein the second inertial motion sensor is an accelerometer.

8. An electronic device, comprising:

a surface; and

an inertial measurement unit (IMU) system coupled to the surface, the IMU system comprising

an IMU circuit board comprising a first side and a second side opposite the first side;

an inertial motion sensor housed in a package bonded to the first side of the IMU circuit board; and

a mounting pedestal coupled to the IMU circuit board on the second side at a location directly opposite the package, the mounting pedestal mounted to the surface.

9. The electronic device of claim 8, wherein the surface is a surface of a circuit board within the device.

10. The electronic device of claim 8, wherein the package and the mounting comprise a same coefficient of thermal expansion.

11. The electronic device of claim 8, wherein the package and the mounting pedestal comprise a same material.

12. The electronic device of claim 8, wherein the package has a first footprint and the mounting pedestal has a second footprint symmetric to the first footprint.

13. The electronic device of claim 8, wherein the inertial motion sensor is a first inertial motion sensor, and further comprising a second inertial motion sensor coupled to the IMU circuit board.

14. The electronic device of claim 13, wherein first inertial motion sensor is a gyroscope, and wherein the second inertial motion sensor is an accelerometer.

15. The electronic device of claim 8, wherein the mounting pedestal is mounted to the surface via an epoxy adhesive.

16. A method for assembling an electronic device comprising an inertial measurement unit (IMU) system, the method comprising:

mounting the IMU system to a surface of the electronic device, the IMU system comprising a package housing an inertial motion sensor, an IMU circuit board having a first side and a second side opposite the first side, and a mounting pedestal, the package mounted to the first side of the IMU circuit board and the mounting pedestal mounted to the second side of the IMU circuit board directly opposite the package.

17. The method of claim 16, wherein mounting the IMU system to the surface of the electronic device comprises mounting the mounting pedestal to the surface of the electronic device.

18. The method of claim 17, wherein mounting the mounting pedestal to the surface of the electronic device comprises mounting the mounting pedestal to the surface of the electronic device via an epoxy adhesive.

19. The method of claim 16, further comprising calibrating output from the inertial motion sensor as a function of IMU system temperature.

20. The method of claim 16, wherein the package has a first footprint, and wherein the mounting pedestal has a second footprint that is symmetric to the first footprint.