PEDESTAL MOUNTING OF SENSOR SYSTEM
First Claim
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1. A system comprising:
- a circuit board comprising a first side and a second side opposite the first side;
a sensor housed in a package bonded to the first side of the circuit board; and
a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device.
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Abstract
Examples related to the incorporation of a sensor into an electronic device are disclosed. One example provides a system including a circuit board comprising a first side and a second side opposite the first side, a sensor housed in a package bonded to the first side of the circuit board, and a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device.
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Citations
20 Claims
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1. A system comprising:
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a circuit board comprising a first side and a second side opposite the first side; a sensor housed in a package bonded to the first side of the circuit board; and a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic device, comprising:
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a surface; and an inertial measurement unit (IMU) system coupled to the surface, the IMU system comprising an IMU circuit board comprising a first side and a second side opposite the first side; an inertial motion sensor housed in a package bonded to the first side of the IMU circuit board; and a mounting pedestal coupled to the IMU circuit board on the second side at a location directly opposite the package, the mounting pedestal mounted to the surface. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method for assembling an electronic device comprising an inertial measurement unit (IMU) system, the method comprising:
mounting the IMU system to a surface of the electronic device, the IMU system comprising a package housing an inertial motion sensor, an IMU circuit board having a first side and a second side opposite the first side, and a mounting pedestal, the package mounted to the first side of the IMU circuit board and the mounting pedestal mounted to the second side of the IMU circuit board directly opposite the package. - View Dependent Claims (17, 18, 19, 20)
Specification