STRUCTURE AND FORMATION METHOD FOR CHIP PACKAGE
First Claim
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1. A chip package, comprising:
- a chip stack including a plurality of semiconductor dies;
a semiconductor chip, wherein the semiconductor chip is higher than the chip stack; and
a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
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Abstract
Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
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Citations
20 Claims
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1. A chip package, comprising:
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a chip stack including a plurality of semiconductor dies; a semiconductor chip, wherein the semiconductor chip is higher than the chip stack; and a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A chip package, comprising:
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a first semiconductor chip; a second semiconductor chip; and a molding compound layer surrounding the first semiconductor chip and the second semiconductor chip, wherein the molding compound layer covers a top surface of the first semiconductor chip, and a top surface of the molding compound layer is substantially coplanar with a top surface of the second semiconductor chip. - View Dependent Claims (13, 14, 15, 16)
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17. A method for forming a chip package, comprising:
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bonding a first semiconductor chip and a second semiconductor chip over a substrate; forming a package layer over the substrate to encapsulate the first semiconductor chip and the second semiconductor chip; and planarizing the package layer so that a top surface of the second semiconductor chip is exposed, and a top surface of the first semiconductor chip is covered by the package layer. - View Dependent Claims (18, 19, 20)
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Specification