LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE

• US 20170005236A1
• Filed: 09/13/2016
• Published: 01/05/2017
• Est. Priority Date: 12/26/2013
• Status: Abandoned Application

• Current Assignee: Genesis Photonics Inc.
• Original Assignee: Genesis Photonics Inc.
• Inventors: Huang, Jing-En, Ting, Shao-Ying, Su, Po-Jen, Wu, Chih-Ling, Huang, Yi-Ru, Lo, Yu-Yun
• Application Number:
  US15/264,564
• Publication Number:
  US 20170005236A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting diode (LED) package includes at least one light emitting unit having a first electrode and a second electrode, a first molding compound covering a part of the light emitting unit to expose the first electrode and the second electrode, and a first light transmissive plate disposed on the first molding compound opposite the light emitting unit. A side surface of the first molding compound and a side surface of the first light transmissive plate are coplanar or have even adjoined edges.

Claims

1. A light emitting diode (LED) package comprising:

at least one light emitting unit having a first electrode and a second electrode;

a first molding compound encapsulating the light emitting unit and at least exposing the first electrode and the second electrode;

a second molding compound comprising a plurality of phosphor particles dispersed therein and covering a part of the first molding compound and at least exposing the first electrode and the second electrode; and

a first light transmissive member disposed on the second molding compound, wherein the second molding compound is disposed between the first light transmissive member and the first molding compound.

2. The LED package of claim 1, further comprising a second light transmissive member disposed between the light emitting unit and the second molding compound.

3. The LED package of claim 2, wherein the second molding compound is disposed between the first light transmissive member and the second light transmissive member.

4. The LED package of claim 2, wherein the second light transmissive member is disposed on the light emitting unit and the first molding compound.

5. The LED package of claim 2, wherein the first molding compound at least encapsulates a lateral surface of the light emitting unit and a surface of the second light transmissive member.

6. The LED package of claim 1, wherein the first molding compound is free of phosphor particles.

7. The LED package of claim 1, wherein the first electrode and the second electrode of the light emitting unit protrude out of a top surface of the first molding compound.

8. The LED package of claim 1, wherein the first electrode and the second electrode of the light emitting unit are coplanar.

9. The LED package of claim 1, wherein the light emitting unit further comprises a substrate, a first type semiconductor layer disposed on the substrate, a light emitting layer disposed on the first type semiconductor layer, and a second type semiconductor layer disposed on the light emitting layer, wherein the first electrode is coupled to the first type semiconductor layer, and the second electrode is coupled to the second type semiconductor layer.

10. The LED package of claim 1, further comprising a support base onto which the first electrode and the second electrode of the light emitting unit are bonded.

11. The LED package of claim 10, wherein the light emitting unit further comprises a first type semiconductor layer, a second type semiconductor layer, and a light emitting layer disposed between the first type semiconductor layer and second type semiconductor layer, wherein the first electrode is coupled to the first type semiconductor layer, and the second electrode is coupled to the second type semiconductor layer.

12. The LED package of claim 1, wherein the second molding compound and the first light transmissive member have coplanar lateral surfaces or have even adjoined edges.