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Light Emitting Diode Package Structure and Fabrication Method

  • US 20170005245A1
  • Filed: 06/24/2016
  • Published: 01/05/2017
  • Est. Priority Date: 07/02/2015
  • Status: Active Grant
First Claim
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1. A light emitting diode package structure, comprising:

  • a first reflecting material layer with through holes;

    a flip chip over the first reflecting material layer, with electrodes inlaid in the through holes of the first reflecting material layer;

    a first transparent material layer surrounding a side surface of the flip chip other than the electrodes;

    a second reflecting material layer surrounding the first transparent material layer, an interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip; and

    a wavelength conversion material layer.

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