HARD COATING FILM AND METHOD OF FORMING SAME

• US 20170009333A1
• Filed: 02/19/2015
• Published: 01/12/2017
• Est. Priority Date: 02/21/2014
• Status: Abandoned Application

• Current Assignee: Klaus Schmidt
• Original Assignee: Klaus Schmidt
• Inventors: NII, Hiroaki, YAMAMOTO, Kenji
• Application Number:
  US15/119,322
• Publication Number:
  US 20170009333A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: C22C 14/00 Alloys based on titanium
• CPC Class Codes: C22C 21/00 Alloys based on aluminium
• CPC Class Codes: C22C 27/06 Alloys based on chromium
• CPC Class Codes: C23C 14/0021 Reactive sputtering or evaporation
• CPC Class Codes: C23C 14/024 Deposition of sublayers, e.g. to promote adhesion of the coating C23C14/027 takes precedence
• CPC Class Codes: C23C 14/0641 Nitrides C23C14/0617 takes precedence
• CPC Class Codes: C23C 14/0647 Boron nitride
• CPC Class Codes: C23C 14/0664 Carbonitrides
• CPC Class Codes: C23C 14/067 Borides
• CPC Class Codes: C23C 14/325 Electric arc evaporation
• CPC Class Codes: C23C 14/34 Sputtering
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 28/042 including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
• CPC Class Codes: C23C 28/044 coatings specially adapted for cutting tools or wear applications
• CPC Class Codes: C23C 28/42 characterized by the composition of the alternating layers

Abstract

The present invention relates to a hard coating film that is formed on a substrate, that is provided with a layer (A) of which the composition is [Ti(BCN)] and a layer (B) of which the composition is [TiAl(CN)], [AlCr(CN)], [TiCrAlSi(CN)], or [TiSi(CN)], and that is characterized in that: a foundation layer comprising the layer (B) is formed on the substrate; an adhesion-reinforcing layer in which the layer (A) and the layer (B) are stacked repeatedly in an alternating manner is formed on the foundation layer; the thickness of the layer (A) increases compared to the foundation layer (2) side as the thickness of the adhesion-reinforcing layer increases; and the maximum thickness of the layer (A) is 20-50 nm. The hard coating film is formed on the substrate surface of a jig tool or the like, has high coating film hardness, and exhibits excellent adhesion and wear resistance during cutting and the like.

Claims

1. A hard film to be formed on a substrate, the hard film comprising:

a layer A having a composition of Ti_w(B_xC_1-x-yN_y)_1-w satisfying

0.2≦

w≦

0.6

0.1≦

x≦

0.8,

0≦

y≦

0.5 and

0≦

1−

x−

y≦

0.5; and

a layer B having a composition of any one of Ti_1-aAl_a(C_1-kN_k), Al_bCr_1-b(C_1-kN_k), Ti_1-c-d-eCr_cAl_dSi_e(C_1-kN_k) and Ti_1-fSi_f(C_1-kN_k), which satisfies

0.3≦

a≦

0.7,

0.3≦

b≦

0.8,

0.3≦

d≦

0.7,

c≦

0.3,

0≦

e≦

0.3,

1−

c−

d−

e≦

0.3,

0.05≦

f≦

0.3 and

0.5≦

k≦

1,

wherein an underlying layer formed of the layer B is formed on the substrate, and an adhesion reinforcing layer in which the layers A and the layers B are alternately repeatedly laminated on one another is formed on the underlying layer, and

the layer A is increased in thickness compared to that on the underlying layer side with an increase in thickness of the adhesion reinforcing layer, and a maximum thickness of the layer A is 20 to 50 nm.

2. The hard film according to claim 1, wherein a layer C is further formed on the adhesion reinforcing layer, the layer C has a composition of TiB₂, and a thickness of the layer C is 5.0 μ

m or less.

3. A method for forming the hard film according to claim 1, the method comprising:

a substrate preparation step of preparing the substrate;

a substrate heating step of heating the substrate; and

a film forming step of forming the hard film on the substrate,

wherein in the film forming step, the underlying layer and the adhesion reinforcing layer are formed by at least one of an arc ion plating process and a sputtering process.

4. A method for forming the hard film according to claim 2, the method comprising:

a substrate preparation step of preparing the substrate;

a substrate heating step of heating the substrate; and

a film forming step of forming the hard film on the substrate,

wherein in the film forming step, the underlying layer, the adhesion reinforcing layer and the layer C are formed by at least one of an arc ion plating process and a sputtering process.